upd75212a Renesas Electronics Corporation., upd75212a Datasheet - Page 66

• Manufacturer Part Number: upd75212a
• Description: 4-bit Single-chip Microcomputer
• Manufacturer: Renesas Electronics Corporation.

66
15. RECOMMENDED SOLDERING CONDITIONS
Mount Manual” (IEI-1207).
* For the storage period after dry-pack decompression storage conditions are max. 25 C, 65 % RH.
Note Use of more than one soldering method should be avoided (except in the case of pin part heating).
Note
Soldering Method
Soldering Method
Infrared reflow
VPS
Pin part heating
Wave soldering
This product should be soldered and mounted under the conditions recommended below.
For details of recommended soldering conditions, refer to the information document “Semiconductor Device
For soldering methods and conditions other than those recommended below, contact our salesman.
Pin part heating
Wave soldering
(lead part only)
A Version of this product with improved recommended soldering condition is available. For details
(improvements such as infrared reflow peak temperature extension (235 C), number of times: twice,
relaxation of time limit, etc.), contact NEC sales personnel.
PD75212AGF-
PD75212ACW-
Ensure that the application of wave soldering is limited to the lead part and no solder touches the main
unit directly.
Notice
Solder bath temperature: 260 C or less, Duration: 10 sec. max.
Number of times: Once, Time limit: 7 days* (thereafter 10 hours prebaking required
at 125 C)
Preheating temperature : 120 C max. (package surface temperature)
Package peak temperature: 230 C, Duration: 30 sec. max. (at 210 C or above),
Number of times: Once, Time limit: 7 days*(thereafter 10 hours prebaking required
at 125 C)
Package peak temperature: 215 C, Duration: 40 sec. max. (at 200 C or above),
Number of times: Once, Time limit: 7 days* (thereafter 10 hours prebaking required
at 125 C)
Pin part temperature: 300 C or below , Duration: 3 sec. max. (per device side)
Solder bath temperature: 260 C or below , Duration: 10 sec. max.
Pin part temperature: 260 C or below , Duration: 10 sec. max.
-3BE : 64-pin plastic QFP (14
: 64-pin plastic shrink DIP (750 mil)
Table 15-1 Surface Mounting Type Conditions
Table 15-2 Insertion Type Soldering Conditions
Soldering Conditions
Soldering Conditions
20 mm)
Condition Symbol
Recommended
WS60-107-1
IR-30-107-1
VP15-107-1
PD75212A
–––