upd17225 Renesas Electronics Corporation., upd17225 Datasheet - Page 75

• Manufacturer Part Number: upd17225
• Description: 4-bit Single-chip Microcontroller For Small General-purpose Infrared Remote Control Transmitter
• Manufacturer: Renesas Electronics Corporation.

16. RECOMMENDED SOLDERING CONDITIONS
Device Mounting Technology Manual" (C10535E).
Caution Do not use two or more soldering methods in combination (except the partial heating method).
Caution Do not use two or more soldering methods in combination (except the partial heating method).
Caution The wave solding must be performed at the lead part only. Note that the solder must not be directly
Infrated Reflow
VPS
Wave Soldering
Partial Heating
Infrated Reflow
VPS
Wave Soldering
Partial Heating
Wave Soldering
(Only for pins)
Partial Heating
Soldering Method
Soldering Method
Soldering Method
(2)
For the PD17225 soldering must be performed under the following conditions.
For details of recommended conditions for surface mounting, refer to information document "Semiconductor
For other soldering methods, please consult with NEC personnel.
(1)
PD17225CT-
PD17226CT-
PD17227CT-
PD17228CT-
PD17225GT-
PD17226GT-
PD17227GT-
PD17228GT-
PD17225MC-
PD17226MC-
PD17227MC-
PD17228MC-
contacted to the package body.
: 28-pin plastic shrink DIP (400 mil)
: 28-pin plastic shrink DIP (400 mil)
: 28-pin plastic shrink DIP (400 mil)
: 28-pin plastic shrink DIP (400 mil)
Package peak temperature: 235 C, Time: 30 seconds max. (210 C min.),
Number of times: 2 max.
Package peak temperature: 215 C, Time: 40 seconds max. (200 C min.),
Number of times: 2 max.
Solder bath temperature: 260 C max, Time: 10 seconds max., Number of times:
once, preheating temperature: 120 C max. (package surface temperature)
Pin temperature: 300 C max., Time: 3 seconds max. (per side of device)
Package peak temperature: 235 C, Time: 30 seconds max. (210 C min.),
Number of times: 3 max.
Package peak temperature: 215 C, Time: 40 seconds max. (200 C min.),
Number of times: 3 max.
Solder bath temperature: 260 C max, Time: 10 seconds max., Number of times:
once, preheating temperature: 120 C max. (package surface temperature)
Pin temperature: 300 C max., Time: 3 seconds max. (per side of device)
Solder bath temperature: 260 C max., Time: 10 seconds max.
Pin temperature: 300 C max., Time: 3 seconds max. (per pin)
: 28-pin plastic SOP (375 mil)
: 28-pin plastic SOP (375 mil)
: 28-pin plastic SOP (375 mil)
: 28-pin plastic SOP (375 mil)
-5A4: 30-pin plastic shrink SOP (300 mil)
-5A4: 30-pin plastic shrink SOP (300 mil)
-5A4: 30-pin plastic shrink SOP (300 mil)
-5A4: 30-pin plastic shrink SOP (300 mil)
Table 16-1. Soldering Conditions of Surface Mount Type
Table 16-2. Soldering Conditions of Through-Hole Type
Data Sheet U12643EJ2V0DS00
Soldering Conditions
Soldering Conditions
Soldering Conditions
PD17225, 17226, 17227, 17228
IR35-00-2
VP15-00-2
WS66-00-1
IR35-00-3
VP15-00-3
WS66-00-1
Symbol
Symbol
—
—
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