ds1339c Maxim Integrated Products, Inc., ds1339c Datasheet - Page 19

no-image

ds1339c

Manufacturer Part Number
ds1339c
Description
Ds1339, Ds1339c, Ds1339u I?c Serial Real-time Clock
Manufacturer
Maxim Integrated Products, Inc.
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DS1339C
Manufacturer:
DALLAS
Quantity:
20 000
Part Number:
ds1339c-2#
Manufacturer:
DALLAS
Quantity:
20 000
Part Number:
ds1339c-3
Manufacturer:
MAXIM/美信
Quantity:
20 000
Part Number:
ds1339c-3#
Manufacturer:
Maxim Integrated Products
Quantity:
135
Part Number:
ds1339c-3#
Manufacturer:
MAXIM
Quantity:
13
Part Number:
ds1339c-33
Manufacturer:
DS
Quantity:
57
Part Number:
ds1339c-33
Manufacturer:
MAXIM/美信
Quantity:
20 000
Part Number:
ds1339c-33#
Manufacturer:
Maxim
Quantity:
3 143
Part Number:
ds1339c-33#
Manufacturer:
Microchip
Quantity:
308
Part Number:
ds1339c-33#
Manufacturer:
MAXIM/美信
Quantity:
20 000
Part Number:
ds1339c-33#T&R
Manufacturer:
MAXIM
Quantity:
10
HANDLING, PC BOARD LAYOUT, AND ASSEMBLY
The DS1339C package contains a quartz tuning-fork crystal. Pick-and-place equipment may be used, but
precautions should be taken to ensure that excessive shocks are avoided. Ultrasonic cleaning should be avoided
to prevent damage to the crystal.
Avoid running signal traces under the package, unless a ground plane is placed between the package and the
signal line. All N.C. (no connect) pins must be connected to ground.
The leaded SO package may be reflowed as long as the peak temperature does not exceed 240°C. Peak reflow
temperature (≥ 230°C) duration should not exceed 10 seconds, and the total time above 200°C should not exceed
40 seconds (30 seconds nominal). Exposure to reflow is limited to 2 times maximum.
The RoHS SO package may be reflowed using a reflow profile that complies with JEDEC J-STD-020 lead-free
assembly.
Moisture-sensitive packages are shipped from the factory dry-packed. Handling instructions listed on the package
label must be followed to prevent damage during reflow. Refer to the IPC/JEDEC J-STD-020B standard for
moisture-sensitive device (MSD) classifications.
PIN CONFIGURATIONS
CHIP INFORMATION
TRANSISTOR COUNT: 11,325
PROCESS: CMOS
THERMAL AND PACKAGE INFORMATION
For the latest package outline information, go to
Maxim/Dallas Semiconductor cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim/Dallas Semiconductor product.
No circuit patent licenses are implied. Maxim/Dallas Semiconductor reserves the right to change the circuitry and specifications without notice at any time.
M a x i m I n t e g r a t e d P r o d u c t s , 1 2 0 S a n G a b r i e l D r i v e , S u n n y v a l e , C A 9 4 0 8 6 4 0 8 - 7 3 7 - 7 6 0 0
µSOP
SO
TOP VIEW
PART
The Maxim logo is a registered trademark of Maxim Integrated Products, Inc. The Dallas logo is a registered trademark of Dallas Semiconductor.
V
BACKUP
GND
X1
X2
THETA-J
(°C/W)
µSOP
DS1339
229
73
A
V
SCL
SDA
SQW/INT
CC
THETA-J
(°C/W)
39
23
C
© 2006 Maxim Integrated Products
CONDITIONS
www.maxim-ic.com/DallasPackInfo
Typical
19 of 19
TOP VIEW
PACKAGE OUTLINE
56-G4009-001
SQW/INT
21-0036
SCL
V
N.C.
N.C.
N.C.
N.C.
N.C.
CC
SO (300 mils)
DS1339 I
DS1339C
.
2
C Serial Real-Time Clock
SDA
GND
N.C.
N.C.
N.C.
N.C.
N.C.
V
BAC UP
K

Related parts for ds1339c