pht1206y1001bgt063 Vishay, pht1206y1001bgt063 Datasheet - Page 4

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pht1206y1001bgt063

Manufacturer Part Number
pht1206y1001bgt063
Description
Manufacturer
Vishay
Datasheet
Note
• For other terminations, please consult
POPULAR OPTIONS
It is recommended to consult Vishay Sfernice for availability first.
Option: Enlarged terminations:
For stringent and special power dissipation requirements, the thermal resistance between the resistive layer and the solder joint
can be reduced using enlarged terminations chip resistors which are soldered on large and thick copper pads acting as heatsink
(see application note: 53048 Power Dissipation in High Precision Vishay Sfernice Chip Resistors and Arrays (P Thin Film, PRA
Arrays, CHP Thick Film) www.vishay.com/doc?53048.
Option to order: 0063 (applies to size 1206/2010).
DIMENSIONS (Option 0063) in millimeters
SUGGESTED LAND PATTERN (Option 0063)
Document Number: 53050
Revision: 10-Aug-10
MECHANICAL SPECIFICATIONS
Substrate
Resistive Element
Passivation
Protection
Terminations
CASE
SIZE
1206
2010
CHIP SIZE
1206
2010
MAX. TOL.
MIN. TOL.
NOMINAL
+ 0.152
- 0.152
3.06
5.08
A
High Precision Wraparound - High Temperature (230 °C)
termination
Enlarged
MAX. TOL.
NOMINAL
MIN. TOL.
+ 0.127
- 0.127
1.60
2.54
E
B
For technical questions, contact:
Thin Film Chip Resistors
Z
3.91
5.93
max.
MAX. TOL.
MIN. TOL.
NOMINAL
Bottom view for mounting
+ 0.13
Z
- 0.13
0.40
0.48
max.
E
F
G
min.
A
DIMENSIONS (in millimeter)
MAX. TOL.
NOMINAL
MIN. TOL.
D
+ 0.13
sfer@vishay.com
- 0.13
1.215
2.25
D
G
0.50
min.
Gold (< 1 µm) over nickel barrier
NOMINAL
B
Silicon nitride (Si
0.63
Epoxy + Silicone
Nichrome (NiCr)
Uncoated
ceramic
Alumina
X
max.
3
N
MIN.
0.50
Vishay Sfernice
4
F
)
X
1.73
2.67
max.
www.vishay.com
MAX.
0.76
PHT
4

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