LTC2757 Linear Technology, LTC2757 Datasheet - Page 19

• Manufacturer Part Number: LTC2757
• Description: 18-Bit SoftSpan IOUT DAC
• Manufacturer: Linear Technology

PACKAGE DESCRIPTION
0.20 – 0.30
0.50 BSC
1.30 MIN
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
1
2
NOTE:
1. PACKAGE DIMENSIONS CONFORM TO JEDEC #MS-026 PACKAGE OUTLINE
2. DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH
48
SHALL NOT EXCEED 0.25mm ON ANY SIDE, IF PRESENT
RECOMMENDED SOLDER PAD LAYOUT
PACKAGE OUTLINE
11° – 13°
0.45 – 0.75
11° – 13°
1.00 REF
7.15 – 7.25
5.50 REF
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
R0.08 – 0.20
SECTION A – A
(Reference LTC DWG # 05-08-1760 Rev Ø)
0° – 7°
48-Lead Plastic LQFP (7mm × 7mm)
GAUGE PLANE
0.25
5.50 REF
LX Package
7.15 – 7.25
0.09 – 0.20
C0.30 – 0.50
1
2
4. PIN-1 INDENTIFIER IS A MOLDED INDENTATION, 0.50mm DIAMETER
5. DRAWING IS NOT TO SCALE
0.50
BSC
48
0.17 – 0.27
SEE NOTE: 4
9.00 BSC
7.00 BSC
www.DataSheet4U.com
A
LTC2757
0.05 – 0.15
1.35 – 1.45
A
7.00 BSC
19
LX48 LQFP 0907 REVØ
9.00 BSC
MAX
1.60
2757f