MC14076BCPG ON Semiconductor, MC14076BCPG Datasheet - Page 7

IC FLIP FLOP QUAD TYPE D 16-DIP

MC14076BCPG

Manufacturer Part Number
MC14076BCPG
Description
IC FLIP FLOP QUAD TYPE D 16-DIP
Manufacturer
ON Semiconductor
Series
4000Br
Type
D-Type Busr
Datasheet

Specifications of MC14076BCPG

Function
Master Reset
Output Type
Non-Inverted
Number Of Elements
1
Number Of Bits Per Element
4
Frequency - Clock
12MHz
Trigger Type
Positive Edge
Current - Output High, Low
8.8mA, 8.8mA
Voltage - Supply
3 V ~ 18 V
Operating Temperature
-55°C ~ 125°C
Mounting Type
Through Hole
Package / Case
16-DIP (0.300", 7.62mm)
Logic Family
4000
Technology
CMOS
Number Of Bits
4
Number Of Elements
1
Clock-edge Trigger Type
Positive-Edge
Polarity
Non-Inverting
Operating Supply Voltage (typ)
3.3/5/9/12/15V
Package Type
PDIP
Propagation Delay Time
600ns
Low Level Output Current
4.2mA
High Level Output Current
-4.2mA
Frequency (max)
6MHz
Operating Supply Voltage (min)
3V
Operating Supply Voltage (max)
18V
Operating Temp Range
-55C to 125C
Operating Temperature Classification
Military
Mounting
Through Hole
Pin Count
16
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Delay Time - Propagation
-
Lead Free Status / Rohs Status
Compliant
Other names
MC14076BCPG
MC14076BCPGOS
16
1
H
−A−
G
F
D
9
8
16 PL
0.25 (0.010)
B
S
K
C
M
−T−
T
A
SEATING
PLANE
PACKAGE DIMENSIONS
M
http://onsemi.com
J
CASE 648−08
P SUFFIX
PDIP−16
ISSUE T
7
L
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS
4. DIMENSION B DOES NOT INCLUDE
5. ROUNDED CORNERS OPTIONAL.
ANSI Y14.5M, 1982.
WHEN FORMED PARALLEL.
MOLD FLASH.
DIM
G
M
A
B
C
D
F
H
J
K
L
S
0.740
0.250
0.145
0.015
0.040
0.008
0.295
0.020
0.110
MIN
0.100 BSC
0.050 BSC
0
INCHES
_
0.770
0.270
0.175
0.021
0.015
0.130
0.305
0.040
MAX
0.70
10
_
18.80
MILLIMETERS
6.35
3.69
0.39
1.02
0.21
2.80
7.50
0.51
MIN
2.54 BSC
1.27 BSC
0
_
19.55
MAX
6.85
4.44
0.53
1.77
0.38
3.30
7.74
1.01
10
_

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