MC74HC74ANG ON Semiconductor, MC74HC74ANG Datasheet
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MC74HC74ANG
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MC74HC74ANG Summary of contents
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... In Compliance with the JEDEC Standard No. 7.0 A Requirements Chip Complexity: 128 FETs or 32 Equivalent Gates Pb−Free Packages are Available* *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 2005 May, 2005 − Rev. 10 http://onsemi.com PDIP− ...
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... Plastic DIP: – 10 mW/_C from 65_ to 125_C SOIC Package: – 7 mW/_C from 65_ to 125_C TSSOP Package: − 6.1 mW/_C from 65_ to 125_C For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High−Speed CMOS Data Book (DL129/D). RECOMMENDED OPERATING CONDITIONS Î Î Î Î ...
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... Current (per Package) Î Î Î Î Î Î Î Î Î Î Î Î Î NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High−Speed CMOS Data Book (DL129/D). AC ELECTRICAL CHARACTERISTICS Î Î Î Î ...
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... ORDERING INFORMATION Device MC74HC74AN MC74HC74ANG MC74HC74AD MC74HC74ADG MC74HC74ADR2 MC74HC74ADR2G MC74HC74ADTR2 ...
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CLOCK 50% 10 1/f max t t PLH PHL 90% 50% 10 TLH THL Figure 1. VALID 50% DATA 50% CLOCK Figure 3. 4, ...
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−T− SEATING PLANE H G −A− −B− −T− SEATING 14 PL PLANE 0.25 (0.010 MC74HC74A PACKAGE DIMENSIONS PDIP−14 N SUFFIX CASE 646−06 ISSUE N 8 ...
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K 14X REF 0.10 (0.004) 0.15 (0.006 L PIN 1 IDENT. 1 0.15 (0.006 −V− C 0.10 (0.004) SEATING −T− PLANE MC74HC74A PACKAGE DIMENSIONS TSSOP−14 DT SUFFIX CASE ...
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... E L DETAIL P VIEW American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. ...