MC14174BCPG ON Semiconductor, MC14174BCPG Datasheet - Page 4
![IC FLIP FLOP D HEX CMOS 16DIP](/photos/6/54/65493/16-dip_648_sml.jpg)
MC14174BCPG
Manufacturer Part Number
MC14174BCPG
Description
IC FLIP FLOP D HEX CMOS 16DIP
Manufacturer
ON Semiconductor
Series
4000Br
Type
D-Type Busr
Specifications of MC14174BCPG
Function
Reset
Output Type
Inverted
Number Of Elements
1
Number Of Bits Per Element
6
Frequency - Clock
15.5MHz
Delay Time - Propagation
65ns
Trigger Type
Positive Edge
Current - Output High, Low
8mA, 8mA
Voltage - Supply
3 V ~ 18 V
Operating Temperature
-55°C ~ 125°C
Mounting Type
Through Hole
Package / Case
16-DIP (0.300", 7.62mm)
Number Of Circuits
7
Logic Family
MC14
Logic Type
D-Type Flip-Flop
Polarity
Non-Inverting
Input Type
Single-Ended
Propagation Delay Time
400 ns
High Level Output Current
- 4.2 mA
Low Level Output Current
4.2 mA
Supply Voltage (max)
18 V
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
Minimum Operating Temperature
- 55 C
Supply Voltage (min)
3 V
Circuit Type
Low-Power Schottky
Current, Supply
600 μA
Function Type
6-Channels, D-Type
Logic Function
Flip-Flop
Package Type
PDIP-16
Special Features
Buffered Output
Temperature, Operating, Range
-55 to +125 °C
Voltage, Supply
3 to 18 VDC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
MC14174BCPGOS
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC14174BCPG
Manufacturer:
ON Semiconductor
Quantity:
1 150
−T−
16
1
SEATING
PLANE
H
16
1
−A−
G
G
D
0.25 (0.010)
−A−
16 PL
F
D
9
8
16 PL
0.25 (0.010)
M
B
S
T
9
8
K
B
K
C
M
−B−
S
−T−
T
A
A
C
S
P
SEATING
PLANE
PACKAGE DIMENSIONS
M
8 PL
0.25 (0.010)
CASE 751B−05
J
CASE 648−08
MC14174B
M
SOIC−16
PDIP−16
ISSUE T
ISSUE J
5
M
L
R
B
X 45
S
_
M
J
F
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS
4. DIMENSION B DOES NOT INCLUDE
5. ROUNDED CORNERS OPTIONAL.
ANSI Y14.5M, 1982.
WHEN FORMED PARALLEL.
MOLD FLASH.
DIM
M
A
B
C
D
G
H
K
S
F
J
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
5. DIMENSION D DOES NOT INCLUDE DAMBAR
0.740
0.250
0.145
0.015
0.040
0.008
0.295
0.020
0.110
MIN
0.100 BSC
0.050 BSC
Y14.5M, 1982.
MOLD PROTRUSION.
PER SIDE.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
0
DIM
INCHES
M
A
B
C
D
F
G
K
P
R
J
_
0.770
0.270
0.175
0.021
0.015
0.130
0.305
0.040
MAX
MILLIMETERS
MIN
0.70
9.80
3.80
1.35
0.35
0.40
0.19
0.10
5.80
0.25
10
1.27 BSC
0
_
_
10.00
18.80
MAX
MILLIMETERS
4.00
1.75
0.49
1.25
0.25
0.25
6.20
0.50
6.35
3.69
0.39
1.02
0.21
2.80
7.50
0.51
MIN
7
2.54 BSC
1.27 BSC
0
_
_
0.386
0.150
0.054
0.014
0.016
0.008
0.004
0.229
0.010
MIN
19.55
MAX
0.050 BSC
6.85
4.44
0.53
1.77
0.38
3.30
7.74
1.01
0
MC14174B/D
10
INCHES
_
_
MAX
0.393
0.157
0.068
0.019
0.049
0.009
0.009
0.244
0.019
7
_