LT6201 Linear Technology, LT6201 Datasheet - Page 22

• Manufacturer Part Number: LT6201
• Description: (LT6200 / LT6201) Op Amp Family
• Manufacturer: Linear Technology

PACKAGE DESCRIPTIO
LT6200/LT6200-5
LT6200-10/LT6201
APPLICATIO S I FOR ATIO
200 C/W,
loads, the worst-case power dissipation is given by:
The maximum ambient temperature that the part is
allowed to operate is:
To operate the device at higher ambient temperature,
connect more metal area to the V
thermal resistance of the package as indicated in Table 1.
DD Package Heat Sinking
The underside of the DD package has exposed metal
(4mm
provides for the direct transfer of heat from the die
junction to printed circuit board metal to help control the
maximum operating junction temperature. The dual-in-
line pin arrangement allows for extended metal beyond the
ends of the package on the topside (component side) of a
22
3.5 0.05
P
T
A
D(MAX)
2.15 0.05
= 150 C – (0.355W • 200 C/W) = 79 C
= T
2
) from the lead frame where the die is attached. This
J
– (P
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
= (10 • 23mA) + (2.5)
= 0.23 + 0.125 = 0.355W
JA
1.65 0.05
(2 SIDES)
0.28 0.05
. Operating on 5V supplies driving 50
D(MAX)
U
• 200 C/W)
2.38 0.05
(2 SIDES)
U
0.50
BSC
2
/50
W
–
U
0.675 0.05
pin to reduce the
PACKAGE
OUTLINE
8-Lead Plastic DFN (3mm 3mm)
(Reference LTC DWG # 05-08-1698)
U
TOP MARK
PIN 1
0.200 REF
DD Package
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
4. EXPOSED PAD SHALL BE SOLDER PLATED
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
PCB. Table 2 summarizes the thermal resistance from the
die junction-to-ambient that can be obtained using various
amounts of topside metal (2oz copper) area. On mulitlayer
boards, further reductions can be obtained using addi-
tional metal on inner PCB layers connected through vias
beneath the package.
Table 2. LT6200 8-Lead DD Package
The LT6200 amplifier family has thermal shutdown to
protect the part from excessive junction temperature. The
amplifier will shut down to approximately 1.2mA supply
current per amplifier if the maximum temperature is
exceeded. The LT6200 will remain off until the junction
temperature reduces to about 135 C, at which point the
amplifier will return to normal operation.
TOPSIDE (mm
COPPER AREA
130
16
32
64
4
3.00 0.10
0.75 0.05
(4 SIDES)
2
)
0.00 – 0.05
1.65 0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
0.28 0.05
(JUNCTION-TO-AMBIENT)
R = 0.115
THERMAL RESISTANCE
TYP
4
5
2.38 0.10
(2 SIDES)
160 C/W
135 C/W
110 C/W
95 C/W
70 C/W
8
1
0.50 BSC
0.38 0.10
(DD8) DFN 0203
62001fa