LT1991 Linear Technology, LT1991 Datasheet - Page 26
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LT1991
Manufacturer Part Number
LT1991
Description
Precision / 100uA Gain Selectable Amplifier
Manufacturer
Linear Technology
Datasheet
1.LT1991.pdf
(28 pages)
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PACKAGE DESCRIPTION
LT1991
26
3.50 ±0.05
2.15 ±0.05
(SEE NOTE 6)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
TOP MARK
1.65 ±0.05
0.25 ± 0.05
(2 SIDES)
PIN 1
0.200 REF
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
TOP AND BOTTOM OF PACKAGE
10-Lead Plastic DFN (3mm × 3mm)
2.38 ±0.05
(2 SIDES)
(Reference LTC DWG # 05-08-1699)
0.50
BSC
DD Package
0.675 ±0.05
0.75 ±0.05
3.00 ±0.10
(4 SIDES)
PACKAGE
OUTLINE
0.00 – 0.05
1.65 ± 0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
5
R = 0.115
6
2.38 ±0.10
(2 SIDES)
TYP
10
1
0.50 BSC
0.25 ± 0.05
0.38 ± 0.10
(DD10) DFN 1103
www.DataSheet4U.com
1991fg