SBT-BGA-7000 Ironwood Electronics, SBT-BGA-7000 Datasheet - Page 2

• Manufacturer Part Number: SBT-BGA-7000
• Description: Socket For Burn-In and Test Applications; Max Pincount: 484; Top Pitch (mm): 0.5; IC Array X: 22; IC Array Y: 22; Socket Lid: Swivel; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: Included; IC Total Height Max (mm): 1.5; IC Siz
• Manufacturer: Ironwood Electronics

Description: SBT-BGA-7000 Recommended PCB layout
Primary dimension units are millimeters, Secondary dimension units are [inches].
Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.13mm [±0.005"], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
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Ironwood Electronics, Inc.
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SBT-BGA-7000 Drawing
1.7000±0.1000 (x4)
Non-Plated Hole
14.7250
WEIGHT:
MATERIAL:
FINISH:
5.2500
5.0800
19.2250 Backing Plate Keep Out Area
17.2250 Socket Keep Out Area
5*
10.5000
STATUS:Released
DRAWN BY: Vinayak R
File: SBT-BGA-7000 Dwg
0.5000 Typ.
Target PCB Recommendations
Total thickness: 1.6mm min.
Plating: Gold or Solder finish
PCB Pad height: Same or higher than solder mask
2.5400
*Note: BGA pattern is not symmetrical
with respect to the mounting holes.
Non-Plated Hole
0.2800 (x484 PAD)
0.8500 (x2)
SHEET 2 OF 4
SCALE: 4:1
DATE: 5/13/2009
REV. A