SKY77162 Skyworks Solutions, SKY77162 Datasheet - Page 11

• Manufacturer Part Number: SKY77162
• Description: System Smart Power Amplifier Module
• Manufacturer: Skyworks Solutions

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SYSTEM SMART
Package and Handling Information
Because of its sensitivity to moisture absorption, this device
package is baked and vacuum-packed prior to shipment.
Instructions on the shipping container label must be followed
regarding exposure to moisture after the container seal is broken,
otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
The SKY77162 is capable of withstanding an MSL3/250 °C solder
reflow. Care must be taken when attaching this product, whether
it is done manually or in a production solder reflow environment.
If the part is attached in a reflow oven, the temperature ramp rate
should not exceed 3 °C per second; maximum temperature
should not exceed 250 °C. If the part is manually attached,
precaution should be taken to insure that the part is not subjected
to temperatures exceeding 250 °C for more than 10 seconds. For
details on both attachment techniques, precautions, and handling
Manufactured
Lot Number
Figure 13. SKY77162 Pad Configuration and Pad Names (Top
Identifier
Package
VCONT
Pin 1
RF_IN
Sealed
VREF
VCC1
Week
Pad layout as seen from top view looking through the package.
GROUND PAD is package underside.
Year
200005A2 • Skyworks Proprietary and Confidential information. • Products and product information are subject to change without notice. • May 2, 2006
®
1
2
4
3
Figure 14. Typical Case Markings
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
PAM FOR CDMA / AMPS (824–849 MHz)
YYWW MX
NNNNN.N
77162-N
GROUND PAD
View)
7
6
5
8
Manufacturing
Part Number
Revision
Number
Country Code
VCC2
RF_OUT
GND
GND
200005_013
200005_014
procedures recommended by Skyworks, please refer to Skyworks
Application Note: PCB Design and SMT Assembly/Rework,
Document Number 101752. Additional information on standard
SMT reflow profiles can also be found in the JEDEC Standard
J-STD–020.
Production quantities of this product are shipped in the standard
tape-and-reel format. For packaging details, refer to Skyworks
Application Note: Tape and Reel – RF Modules, Document
Number 101568.
Electrostatic Discharge Sensitivity
The SKY77162 is a Class 2 device.
Discharge (ESD) immunity level for each non-ground pad of the
SKY77162 product. The numbers in
threshold level for each pad where the I-V curve between the pad
and ground starts to show degradation.
The ESD testing was performed in compliance with
MIL-STD-883E Method 3015.7 using the Human Body Model. If
ESD damage threshold magnitude is found to consistently exceed
2000 volts on a given pad, this so is indicated. If ESD damage
threshold below 2000 volts is measured for either polarity,
numbers are indicated that represent worst case values observed
in product characterization.
Various failure criteria can be utilized when performing ESD
testing. Many vendors employ relaxed ESD failure standards,
which fail devices only after “the pad fails the electrical
specification limits” or “the pad becomes completely non-
functional”. Skyworks employs most stringent criteria and fails
devices as soon as the pad begins to show any degradation on a
curve tracer.
To avoid ESD damage, both latent and visible, it is very important
that the product assembly and test areas follow the Class-1 ESD
handling precautions listed in
VCONT
> + 2 kV
< – 2 kV
RF_IN
> + 2 kV
< – 2 kV
> + 2 kV
< – 2 kV
> + 2 kV
< – 2 kV
VCC1
VREF
Pad layout as seen from top view looking through the package.
Pad layout as seen from top view looking through the package.
Figure 15. ESD Sensitivity Areas (Top View)
1
2
3
4
GROUND PAD
Table
Figure 15
4.
Figure 15
DATA SHEET • SKY77162
lists the Electrostatic
specify the ESD
8
7
6
5
VCC2
> + 2 kV
< – 2 kV
RF_OUT
> + 2 kV
< – 2 kV
GND
GND
200005_014
11