SPI-335-34 Sanyo Semicon Device, SPI-335-34 Datasheet - Page 2

• Manufacturer Part Number: SPI-335-34
• Description: Ultraminiature photoreflector (single-transistor type)
• Manufacturer: Sanyo Semicon Device

Package dimensions and Pin connection
As stated in the sttached paper. (No.6029 5/6)
Rank marking of collector output
The bottom of the package is colored following the table of classification of collector output.
Lot marking
Color division shall be done as shown in the drawing. (Fig. 2)
Year of even number : Front side
Year of odd number
Soldering conditions
(1) Temperature
(2) Time
(3) Clearance
(1) Bending a lead should avoid. However, when bending is necessary, take care the next items.
(2) The hole pitch of a circuit board must fit to the lead pitch.
(3) Take core the following when soldering.
(4) Use the flux which contain no chlorine, have no corrosion and do not need washing.
(5) Be careful that flux or other chemicals do not attach to the luminous surface and passive surface.
Part ‘B’
Part ‘A’
q Bending a lead must be done before soldering.
w Bending a lead must be done in the states of fixing leads and no stress for the regin part. Because it is possible that
e A lead must be bend at intervals of 2mm from the case edge.
r Do not bend the same position of leads more than twice.
q Do not heat a product under any stress (a twist and so on) to leads.
w Do not heat a product in the states of operating force to the regin part.
Color
PRECAUTIONS
stress for the regin part cause troubles such as gold wire breaking and so on.
January
Black
July
: Max. 260 C
: Max. 3sec
: Min. 1mm from the case edge. (Fig. 3)
: Back side
February
August
Blue
September
March
Red
SPI-335-34
October
Green
April
November
Orange
Front side
May
Fig. 3
A
B
December
Brown
Fig. 2
June
No.6029 2/6