SPI-235-19 Sanyo Semicon Device, SPI-235-19 Datasheet - Page 5

• Manufacturer Part Number: SPI-235-19
• Description: Ultraminiature photointerrupter (single-transistor type)
• Manufacturer: Sanyo Semicon Device

Package dimensions and Pin connection
As stated in the sttached paper. (No.6024 4/6)
Soldering conditions
(1) Temperature : Max. 260 C
(2) Time
(3) Clearance
(1) Bending a lead should avoid. However, when bending is necessary, take care the next items.
(2) The hole pitch of a circuit board must fit to the lead pitch.
(3) Two stays coupling LED and Ph. Tr should be isolated from any PCB pattern or any lead.
(4) Take core the following when soldering.
(5) Use the flux which contain no chlorine, have no corrosion and do not need washing.
(6) Be careful that flux or other chemicals do not attach to the luminous surface and passive surface.
q Bending a lead must be done before soldering.
w Bending a lead must be done in the states of fixing leads and no stress for the regin part. Because it is possible that
e A lead must be bend under the stay.
r Do not bend the same position of leads more than twice.
q Do not heat a product under any stress (a twist and so on) to leads.
w Do not heat a product in the states of operating force to the regin part.
PRECAUTIONS
stress for the regin part cause troubles such as gold wire breaking and so on.
: Max. 3 sec
: Min. 1mm from stay (include PCB thickness)
SPI-235-19
No.6024 5/6