MTB36N06V Motorola, MTB36N06V Datasheet
MTB36N06V
Related parts for MTB36N06V
MTB36N06V Summary of contents
Page 1
... Designer’ trademark of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc. Thermal Clad is a trademark of the Bergquist Company. REV 2 Motorola TMOS Power MOSFET Transistor Device Data Motorola, Inc. 1996 D G Rating 50 s) Order this document by MTB36N06V/D MTB36N06V Motorola Preferred Device TMOS POWER FET 32 AMPERES 60 VOLTS R DS(on) = 0.04 OHM TM CASE 418B–02, Style 2 S ...
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... MTB36N06V ELECTRICAL CHARACTERISTICS ( unless otherwise noted) Characteristic OFF CHARACTERISTICS Drain–to–Source Breakdown Voltage ( Vdc 250 Adc) Temperature Coefficient (Positive) Zero Gate Voltage Drain Current ( Vdc Vdc Vdc Vdc 150 C) Gate–Body Leakage Current ( Vdc Vdc) ...
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... Figure 4. On–Resistance versus Drain Current 1000 100 10 1 125 150 175 DRAIN–TO–SOURCE VOLTAGE (VOLTS) Figure 6. Drain–To–Source Leakage MTB36N06V 100 – DRAIN CURRENT (AMPS) ...
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... MTB36N06V Switching behavior is most easily modeled and predicted by recognizing that the power MOSFET is charge controlled. The lengths of various switching intervals ( t) are determined by how fast the FET input capacitance can be charged by current from the generator. The published capacitance data is difficult to use for calculat- ing rise and fall because drain– ...
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... DM ), the energy rating is specified at rated continuous current ( accordance with industry custom. The energy rating must be derated for temperature as shown in the accompanying graph (Figure 12). Maximum energy at currents below rated continuous I D can safely be assumed to equal the values indicated. MTB36N06V d(off) t d(on) 10 ...
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... MTB36N06V 1000 DS(on) LIMIT SINGLE PULSE THERMAL LIMIT PACKAGE LIMIT 100 10 100 0 DRAIN–TO–SOURCE VOLTAGE (VOLTS) Figure 11. Maximum Rated Forward Biased Safe Operating Area 1. 0.5 0.2 0.1 0.05 0.10 0.02 0.01 SINGLE PULSE 0.01 1.0E–05 1.0E–04 di/ 0. Figure 14 ...
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... Area for the D 2 PAK Package (Typical) Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Clad . Using a board material such as Thermal Clad, an aluminum core board, the power dissipation can be doubled using the same footprint. MTB36N06V ...
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... MTB36N06V Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. Solder stencils are used to screen the optimum amount. These stencils are typically 0.008 inches thick and may be made of brass or stainless steel. For packages such as the SC–59, SC– ...
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... C 160 C 150 C SOLDER IS LIQUID FOR SECONDS 100 C 140 C (DEPENDING ON MASS OF ASSEMBLY) DESIRED CURVE FOR LOW MASS ASSEMBLIES Figure 18. Typical Solder Heating Profile MTB36N06V STEP 6 STEP 7 VENT COOLING 205 TO 219 C PEAK AT SOLDER JOINT T MAX 9 ...
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... DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. INCHES MILLIMETERS DIM MIN MAX MIN MAX A 0.340 0.380 8.64 9.65 B 0.380 0.405 9.65 10.29 C 0.160 0.190 4.06 4.83 D 0.020 0.035 0.51 0.89 E 0.045 0.055 1.14 1.40 G 0.100 BSC 2.54 BSC H 0.080 0.110 2.03 2.79 J 0.018 0.025 0.46 0.64 K 0.090 0.110 2.29 2.79 S 0.575 0.625 14.60 15.88 V 0.045 0.055 1.14 1.40 MTB36N06V/D ...