AD8016ARP-EVAL Analog Devices, AD8016ARP-EVAL Datasheet - Page 15

• Manufacturer Part Number: AD8016ARP-EVAL
• Description: Low Power, High Output Current xDSL Line Driver
• Manufacturer: Analog Devices

EXPERIMENTAL RESULTS
The experimental data suggests that for both packages, and a
PCB as small as 4.7 square inches, reasonable junction tempera-
tures can be maintained even in the absence of air flow. The graph
in Figure 42 shows junction temperature versus air flow for various
dimensions of 1 ounce copper PCBs at an ambient temperature
of 24°C in both the ARB and ARP packages. For the worst case
package, the AD8016ARB and the worst case PCB at 4.7 square
inches, the extrapolated junction temperature for an ambient
environment of 85°C would be approximately 132°C with 0 LFM
of air flow. If the target maximum junction temperature of the
AD8016ARB is 125°C, a 4-layer PCB with 1 oz. copper covering
the outer layers and measuring 9 square inches is required
with 0 LFM of air flow.
Note that the AD8016ARE is targeted at xDSL applications
other than full-rate CO ADSL. The AD8016ARE is targeted at
g.lite and other xDSL applications where reduced power dissi-
pation can be achieved through a reduction in output power.
Extreme temperatures associated with full-rate ADSL using the
AD8016ARE should be avoided whenever possible.
75
70
65
60
55
50
45
40
0
ARP 4.7 SQ-IN
ARB 4.7 SQ-IN
ARB 7.125 SQ-IN
ARP 9 SQ-IN
50
ARP 6 SQ-IN
ARB 6 SQ-IN
AIR FLOW – LFM
100
ARP 12 SQ-IN
ARB 9 SQ-IN
+24 C AMBIENT
150
200
45
35
35
30
25
20
15
10
50
40
30
25
20
15
10
0
4
1
ARP 0 LFM
ARB 0 LFM
2
ARP 50 LFM
3
PCB AREA – SQ-IN
PCB AREA – SQ-IN
7
ARB 50 LFM
4
ARB 150 LFM
ARP 150 LFM
ARE 0 LFM
ARE 200 LFM
5
ARP 100 LFM
ARB 100 LFM
ARE 400 LFM
6
7
10
ARB 200 LFM
ARP 200 LFM
8
AD8016
9
10