NTMD6P02R2 ON Semiconductor, NTMD6P02R2 Datasheet - Page 6

• Manufacturer Part Number: NTMD6P02R2
• Description: Power MOSFET
• Manufacturer: ON Semiconductor

design. The footprint for the semiconductor packages must
be the correct size to ensure proper solder connection
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within
a short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
Surface mount board layout is a critical portion of the total
The melting temperature of solder is higher than the rated
Always preheat the device.
The delta temperature between the preheat and
soldering should be 100 C or less.*
When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering
method, the difference shall be a maximum of 10 C.
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
INFORMATION FOR USING THE SO–8 SURFACE MOUNT PACKAGE
SOLDERING PRECAUTIONS
http://onsemi.com
NTMD6P02R2
6
interface between the board and the package. With the
correct pad geometry, the packages will self–align when
subjected to a solder reflow process.
* Soldering a device without preheating can cause
excessive thermal shock and stress which can result in
damage to the device.
The soldering temperature and time shall not exceed
260 C for more than 10 seconds.
When shifting from preheating to soldering, the
maximum temperature gradient shall be 5 C or less.
After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and
result in latent failure due to mechanical stress.
Mechanical stress or shock should not be applied
during cooling.
inches
mm