HCTS20D Intersil Corporation, HCTS20D Datasheet - Page 8

• Manufacturer Part Number: HCTS20D
• Description: Radiation Hardened Dual 4-Input NAND Gate
• Manufacturer: Intersil Corporation

Die Characteristics
DIE DIMENSIONS:
METALLIZATION:
GLASSIVATION:
WORST CASE CURRENT DENSITY:
BOND PAD SIZE:
Metallization Mask Layout
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
2.20 x 2.24(mm)
Type: SiAl
Metal Thickness: 11k
Type: SiO
Thickness: 13k
<2.0 x 10
100 m x 100 m
4 mils x 4 mils
The mask series for the HCTS20 is TA14426A.
NC (3)
B1 (2)
C1 (4)
D1 (5)
5
2
A/cm
Å
2
2.6k
Å
Å
1k
Å
A1
(1)
(6)
Y1
HCTS20MS
HCTS20MS
GND
VCC
(14)
(7)
427
(13)
(8)
Y2
D2
Spec Number
(12) C2
(11) NC
(10) B2
(9) A2
518619