BUK9635-55 Philips Semiconductors, BUK9635-55 Datasheet
BUK9635-55
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BUK9635-55 Summary of contents
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... CONDITIONS - ˚ 100 ˚ ˚ ˚ CONDITIONS Human body model (100 pF, 1 CONDITIONS - Minimum footprint, FR4 board 1 Product specification BUK9635-55 MAX 175 SYMBOL MIN. MAX. UNIT - 136 - 175 MIN ...
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... Measured from source lead soldering point to source bond pad CONDITIONS -dI /dt = 100 - Product specification BUK9635-55 MIN. TYP. MAX. UNIT 1 0 2.3 - 0.05 ...
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... ID/A 100 10 120 140 160 180 f & 0.1 0.01 120 140 160 180 Product specification BUK9635-55 MIN. TYP. MAX ˚C mb RDS(ON) = VDS/ VDS/V Fig.3. Safe operating area ˚ f single pulse; parameter ZTH/ (K/W) 1 0.5 0.2 0 ...
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... Fig.9. Normalised drain-source on-state resistance VGS(TO 2.5 2 1.5 1 0.5 0 -100 GS(TO) 4 Product specification BUK9635- ID f(I ); conditions BUK959-60 Rds(on) normlised to 25degC a - 100 150 Tmb / degC / DS(ON) DS(ON)25 ˚ ...
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... Ciss Coss Crss 10 100 , Fig.15. Normalised avalanche energy rating. iss oss rss VDS = 44V VGS Product specification BUK9635-55 Tj/C = 175 0 0.5 1 VSDS/V Fig.14. Typical reverse diode current. = f(V ); conditions parameter T SDS GS WDSS ...
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... Philips Semiconductors TrenchMOS transistor Logic level FET RD VGS RG 0 Fig.17. Switching test circuit. April 1998 VDD + VDS - T.U.T. 6 Product specification BUK9635-55 Rev 1.100 ...
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... Observe the general handling precautions for electrostatic-discharge sensitive devices (ESDs) to prevent damage to MOS gate oxide. 2. Epoxy meets UL94 V0 at 1/8". April 1998 10.3 max 11 max 15.4 0.85 max (x2) Fig.18. SOT404 : centre pin connected to mounting base. 11.5 9.0 2.0 3.8 5.08 Fig.19. SOT404 : soldering pattern for surface mounting . 7 Product specification BUK9635-55 4.5 max 1.4 max 2.5 0.5 17.5 Rev 1.100 ...
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... Philips customers using or selling these products for use in such applications their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. April 1998 8 Product specification BUK9635-55 Rev 1.100 ...