ACS709 Allegro MicroSystems, Inc., ACS709 Datasheet - Page 16

• Manufacturer Part Number: ACS709
• Description: High Bandwidth, Fast Fault Response Current Sensor Ic In Thermally Enhanced Package
• Manufacturer: Allegro MicroSystems, Inc.

ACS709
mit improvements in the per for mance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the
information being relied upon is current.
failure of that life support device or system, or to affect the safety or effectiveness of that device or system.
nor for any in fringe ment of patents or other rights of third parties which may result from its use.
24X
Copyright ©2008-2009, Allegro MicroSystems, Inc.
The products described herein are protected by U.S. patents: 7,166,807; 7,425,821; 7,573,393; and 7,598,601.
Allegro MicroSystems, Inc. reserves the right to make, from time to time, such de par tures from the detail spec i fi ca tions as may be required to per-
Allegro’s products are not to be used in life support devices or systems, if a failure of an Allegro product can reasonably be expected to cause the
The in for ma tion in clud ed herein is believed to be ac cu rate and reliable. How ev er, Allegro MicroSystems, Inc. assumes no re spon si bil i ty for its use;
0.20
C
A
B
C
0.30
0.20
Reference pad layout (reference IPC7351 SOP63P600X175-24M)
All pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary
to meet application process requirements and PCB layout tolerances
Terminal #1 mark area
Branding scale and appearance at supplier discretion
For Reference Only, not for tooling use (reference JEDEC MO-137 AE)
Dimensions in millimeters
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
24
1
2
A
8.66 ±0.10
0.635 BSC
Branded Face
For the latest version of this document, visit our website:
High Bandwidth, Fast Fault Response Current Sensor IC
Package LF, 24-pin QSOP
3.91 ±0.10
1.75 MAX
0.25 MAX
www.allegromicro.com
SEATING
PLANE
5.99 ±0.20
C
GAUGE PLANE
1.27
0.41
8º
0º
0.25 BSC
In Thermally Enhanced Package
SEATING PLANE
0.25
0.15
1.04 REF
2.30
115 Northeast Cutoff
1.508.853.5000; www.allegromicro.com
Allegro MicroSystems, Inc.
Worcester, Massachusetts 01615-0036 U.S.A.
C
LF = (Literal) Package type
Standard Branding Reference View
N = Device part number
T = Temperature code
A = Amperage
0.40
NNNNNNNNNNNNN
TL F-AAA
LLLLLLLLLLL
B
PCB Layout Reference View
0.635
16
5.00