AN1231 Motorola / Freescale Semiconductor, AN1231 Datasheet - Page 19

no-image

AN1231

Manufacturer Part Number
AN1231
Description
Plastic Ball Grid Array (PBGA)
Manufacturer
Motorola / Freescale Semiconductor
Datasheet
Array Carriers (OMPAC): A Low Cost, High Interconnect
Density IC Packaging Solution for Consumer and Industrial
Electronics”, Proceedings of the Technical Conference, 1991
ECTC, pp. 176 – 182.
Electronics , February 14, 1994, pp. 59 – 73.
Packaging , Summer 1993, pp. 44 – 46.
Packaging , Winter 1993, pp. 38 – 39.
Grid Array Packaging”, NEPCON East Proceedings, 1993,
pp. 413 – 425.
140 and 225 Pin Ball Grid Array Packages”, NEPCON East
Proceedings, 1993.
Plastic Pad Array Carriers (OMPAC)”, 1993 IEEE/CHMT
International Electronics Manufacturing Technology Sym-
posium Proceedings, pp. 63 – 75.
ages”, Electronic Design , October 14, 1993, pp. 34 – 35.
Packaging & Production , May 1992, pp. 25 – 26.
Overmolded Pad Array Carrier”, 1993 International Electron-
ics Packaging (IEPS) Conference Proceedings, pp.
740 – 748.
Thermal Cycling and Application Fatigue Life of the Plastic
MOTOROLA FAST SRAM
B. Freyman and R. Pennisi, “Overmolded Plastic Pad
A. Fukuda, Feature Article on BGAs (in Japanese), Nikkei
D. Hattas, “BGAs Face Production Testing”, Advanced
J. Houghten, “New Package Takes on QFP’s”, Advanced
R. Johnson, A. Mawer et al., “A Feasibility Study of Ball
R. Johnson and D. Cawthon, “Thermal Characterization of
J. Lau et al., “No Clean Mass Reflow of Large Over Molded
D. Maliniak, “BGAs Make Transition to Memory Pack-
H. Markstein, “Pad Array Improves Density”, Electronic
F. Martin, “C-5 Solder Sphere Robotic Placement Cell for
A. Mawer, R. Darveaux and M. Petrucci, “Calculation of
Ball Grid Array (BGA) Package”, 1993 International Electron-
ics Packaging (IEPS) Conference, 1993, pp. 718 – 730.
Phenomenon in Overmolded Plastic Pad Array Carriers
(OMPAC)”, 1992 International Electronics Packaging (IEPS)
Conference Proceedings, pp. 605 – 614.
Technology , August 1993, p. 40.
Creep Analyses of C5 Solder Pads Using FEM Simulation,”
APDC Technical Report 15-92, 1992.
ceedings of the 1993 Surface Mount International Con-
ference, pp. 86 – 90.
Report #88CRD261, 1988.
Circuit Board”, Proceedings of the 1994 EuPAC Conference,
Feb 1 – 3, 1994, Essen, Germany.
December 1993, pp. 20 – 21.
August 1993, pp. 24 – 27.
International, Inc. Consulting Report, January, 1993.
molded Pad Array Carrier (OMPAC), 1993 International
Electronics Packaging (IEPS) Conference Proceedings, pp.
731 – 739.
B. Miles and B. Freyman, “The Elimination of the Popcorn
K. O’Brien, “Will BGA Live Up to Its Billing”, Surface Mount
B. Nagaraj and M. Mahalingam, “OMPAC Package —
J. Shimizu, “Plastic Ball Grid Array Coplanarity”, Pro-
H. Solomon, “Strain-Life Behavior in 60/40 Solder”, GE
C. Trigas, “The OMPAC Package — Assembly to Printed
J. Tuck, “BGAs: A Trend in the Making”, Circuits Assembly ,
J. Tuck, “BGAs: The Next Chapter”, Circuits Assembly ,
J. Vardaman, “Ball Grid Array Packaging”, TechSearch
W. Yip and C. Tsai, “Electrical Performance of an Over-
AN1231
19

Related parts for AN1231