RF5125 RF Micro Devices, RF5125 Datasheet - Page 10

• Manufacturer Part Number: RF5125
• Description: LINEAR POWER AMPLIFIER
• Manufacturer: RF Micro Devices

RF5125
PCB Surface Finish
The PCB surface finish used for RFMD's qualification process is electroless nickel, immersion gold. Typical thickness is 3μinch
to 8μinch gold over 180μinch nickel.
PCB Land Pattern Recommendation
PCB land patterns for RFMD components are based on IPC-7351 standards and RFMD empirical data. The pad pattern shown
has been developed and tested for optimized assembly at RFMD. The PCB land pattern has been developed to accommodate
lead and package tolerances. Since surface mount processes vary from company to company, careful process development is
recommended.
PCB Metal Land Pattern
Figure 1. PCB Metal Land Pattern (Top View)
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7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at ([phone] or [e-mail].
0.55 Typ.
0.50 Typ.
PCB Design Requirements
0.55 Typ.
Pin 1
0.50 Typ.
Pin 16
A
A
A
A
A = 0.64 x 0.28 (mm) Typ.
B = 0.28 x 0.64 (mm) Typ.
C = 1.50 (mm) Sq.
B
B
1.50 Typ.
B
B
C
0.75 Typ.
B
B
B
B
Pin 8
Dimensions in mm.
A
A
A
A
Pin 12
0.75 Typ.
1.50
Typ.
Rev A23 DS070515