RF3163 RF Micro Devices, RF3163 Datasheet

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RF3163

Manufacturer Part Number
RF3163
Description
3V 900MHZ LINEAR POWER AMPLIFIER MODULE
Manufacturer
RF Micro Devices
Datasheet

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Product Description
The RF3163 is a high-power, high-efficiency linear ampli-
fier module specifically designed for 3V handheld sys-
tems. The device is manufactured on an advanced third
generation GaAs HBT process, and was designed for use
as the final RF amplifier in 3V IS-95/CDMA 2000
1X/AMPS handheld digital cellular equipment, spread-
spectrum systems, and other applications in the 824MHz
to 849MHz band. The RF3163 has a digital control line
for low power applications to lower quiescent current. The
RF3163 is assembled in a 16-pin, 3mmx3mm, QFN
package.
Optimum Technology Matching® Applied
Rev A0 040730
Typical Applications
• 3V CDMA/AMPS Cellular Handset
• 3V CDMA2000/1XRTT Cellular Handset
Si BJT
Si Bi-CMOS
InGaP/HBT
VMODE
VREG
RF IN
NC
Functional Block Diagram
1
2
3
4
16
5
GaAs HBT
SiGe HBT
GaN HEMT
Bias
15
6
0
14
7
13
8
GaAs MESFET
Si CMOS
SiGe Bi-CMOS
12
11
10
9
RF OUT
VCC2
VCC2
VCC2
• 3V CDMA2000/1X-EV-DO US-Cellular
• Spread-Spectrum System
Handset
Features
Ordering Information
RF Micro Devices, Inc.
7628 Thorndike Road
Greensboro, NC 27409, USA
• Input Internally Matched@50Ω
• Output Internally Matched
• 28dBm Linear Output Power
• 41% Peak Linear Efficiency
• -51dBc ACPR @ 885kHz
• 55% AMPS Efficiency
RF3163
RF3163 PCBA
1.45
0.50 TYP.
0.10 C
0.10 C
0.30
0.18
+0.10
1.45
-0.15
Package Style: QFN, 16-Pin, 3x3
0.10 C
TYP.
0.10
+0.10
-0.15
M
C A B
3V 900MHz Linear Power Amplifier Module
Fully Assembled Evaluation Board
3.00
Shaded areas represent pin 1.
3V 900MHZ LINEAR POWER
0.10 C
Dimensions in mm.
0.50
0.30
-A-
3.00
-B-
TYP.
AMPLIFIER MODULE
0.10 C
1.00
0.80
RF3163
0.08 C
http://www.rfmd.com
Fax (336) 664 0454
Tel (336) 664 1233
-C-
0.05
0.00
SCALE:
NONE
SEATING
PLANE
2-689

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RF3163 Summary of contents

Page 1

... RF amplifier in 3V IS-95/CDMA 2000 1X/AMPS handheld digital cellular equipment, spread- spectrum systems, and other applications in the 824MHz to 849MHz band. The RF3163 has a digital control line for low power applications to lower quiescent current. The RF3163 is assembled in a 16-pin, 3mmx3mm, QFN package. Optimum Technology Matching® ...

Page 2

... RF3163 Absolute Maximum Ratings Parameter Supply Voltage (RF off) ≤31dBm) Supply Voltage (P OUT Control Voltage (V ) REG Input RF Power Mode Voltage (V ) MODE Operating Temperature Storage Temperature Moisture Sensitivity Level (IPC/JEDEC J-STD-20) Parameter Min. High Power Mode (V Low) MODE Operating Frequency Range Linear Gain 26 ...

Page 3

... RF3163 Unit Condition o T=25 C Ambient, V =3.4V =0V, and P =31dBm for all MODE OUT parameters (unless otherwise specified). MHz dBm % dBc dBc =low and V =2.8V MODE REG mA V =high and V =2.8V MODE REG mA V ...

Page 4

... RF3163 Pin Function Description connection. Do not connect this pin to any external circuit. 2 VREG Regulated voltage supply for amplifier bias circuit. In power down mode, both V 3 VMODE For nominal operation (High Power mode), V set HIGH, devices are biased lower to improve efficiency. ...

Page 5

... LL1608-F1N8S). 2 GND The value of the inductor can be from 1.5nH to 2.2nH. Different values of the inductor will give slight shift on P2-3 3 VREG the tradeoff between efficiency and ACPR. 4 GND P2-5 VMODE 5 CON5 RF3163 50 Ω µstrip OUT VCC2 C1 C10 4.7 µF 2200 pF 9 2-693 ...

Page 6

... RF3163 Electrostatic Discharge Sensitivity Human Body Model (HBM) Figure 3 shows the HBM ESD sensitivity level for each pin to ground. The ESD test is in compliance with JESD22-A114. 2000 V VREG 2000 V VMODE Figure 3. ESD Level - Human Body Model Machine Model (MM) Figure 4 shows the MM ESD sensitivity level for each pin to ground. The ESD test is in compliance with JESD22-A115. ...

Page 7

... Typ. Figure 1. PCB Metal Land Pattern (Top View) Rev A0 040730 PCB Design Requirements A = 0.64 x 0.28 (mm) Typ 0.28 x 0.64 (mm) Typ 0.64 x 1.28 (mm 1.50 (mm) Sq. Dimensions in mm. 1.50 Typ. 0.50 Typ. Pin Pin 1 Pin 0.75 Typ Pin 8 0.55 Typ. 0.75 Typ. RF3163 1.00 Typ. 2-695 ...

Page 8

... RF3163 PCB Solder Mask Pattern Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the PCB metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all pads. The center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask clearance can be provided in the master data or requested from the PCB fabrication supplier ...

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