LM3673TLX-1.2 National Semiconductor, LM3673TLX-1.2 Datasheet - Page 4
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LM3673TLX-1.2
Manufacturer Part Number
LM3673TLX-1.2
Description
LM3673 2MHz, 350mA Step-Down DC-DC Converter; Package: MICRO SMD; No of Pins: 5; Qty per Container: 3000; Container: Reel
Manufacturer
National Semiconductor
Datasheet
1.LM3673TLX-1.2.pdf
(20 pages)
www.national.com
V
V
V
I
I
R
R
I
V
V
I
F
SHDN
Q
LIM
EN
OSC
IN
FB
REF
IH
IL
DSON (P)
DSON (N)
Absolute Maximum Ratings
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Electrical Characteristics
apply over the full operating ambient temperature range (−30°C
the LM3673TL with V
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of
the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see
the Electrical Characteristics tables.
Note 2: All voltages are with respect to the potential at the GND pin.
Note 3: Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T
T
Note 4: The Human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF capacitor discharged
directly into each pin. MIL-STD-883 3015.7
Note 5: In Applications where high power dissipation and/or poor package resistance is present, the maximum ambient temperature may have to be derated.
Maximum ambient temperature (T
the application (P
− (θ
Note 6: Junction to ambient thermal resistance is highly application and board layout dependent. In applications where high power dissipation exists, special care
must be given to thermal dissipation issues in board design. Specified value of 85 °C/W for µSMD is based on a 4 layer, 4" x 3", 2/1/1/2 oz. Cu board as per
JEDEC standards is used.
Note 7: Refer to datasheet curves for closed loop data and its variation with regards to supply voltage and temperature. Electrical Characteristic table reflects
open loop data (FB=0V and current drawn from SW pin ramped up until cycle by cycle current limit is activated). Closed loop current limit is the peak inductor
current measured in the application circuit by increasing output current until output voltage drops by 10%.
Note 8: Min and Max limits are guaranteed by design, test or statistical analysis. Typical numbers are not guaranteed, but do represent the most likely norm.
Note 9: The parameters in the electrical characteristic table are tested at V
refer to datasheet curves.
V
FB, SW, EN Pin:
Continuous Power Dissipation
(Note 3)
Junction Temperature (T
Storage Temperature Range
Maximum Lead Temperature
ESD Rating (Note 4)
Symbol
J
= 130°C (typ.).
IN
(Soldering, 10 sec.)
JA
Pin: Voltage to GND
x P
D-MAX
). Refer to Dissipation rating table for P
Input Voltage
Feedback Voltage (Fixed / ADJ) TL
Line Regulation
Load Regulation
Internal Reference Voltage
Shutdown Supply Current
DC Bias Current into V
Pin-Pin Resistance for PFET
Pin-Pin Resistance for NFET
Switch Peak Current Limit
Logic High Input
Logic Low Input
Enable (EN) Input Current
Internal Oscillator Frequency
D-MAX
) and the junction to ambient thermal resistance of the package (θ
IN
= EN = 3.6V
J-MAX
A-MAX
Parameter
)
) is dependent on the maximum operating junction temperature (T
IN
Internally Limited
−65°C to +150°C
D-MAX
(Notes 2, 8, 9)
(GND−0.2V) to
−0.2V to 6.0V
(Note 1)
(V
values at different ambient temperatures.
IN
+125°C
+ 0.2V)
260°C
(Note 10)
PWM mode (Note 11)
2.7V
I
150 mA
V
EN = 0V
No load, device is not switching (FB
forced higher than programmed
output voltage)
V
V
Open Loop (Note 7)
PWM Mode (Note 11)
O
IN
IN
IN
= 20 mA
= 3.6V
= V
= V
≤
IN
Limits in standard typeface are for T
GS
GS
= 3.6V unless otherwise specified. For performance over the input voltage range
V
≤
4
IN
= 3.6V
= 3.6V
≤
I
≤
O
T
Condition
A
≤
Operating Ratings
Thermal Properties
5.5V
Input Voltage Range (Note 10)
Recommended Load Current
Junction Temperature (T
Ambient Temperature (T
5)
Junction-to-Ambient Thermal
Resistance (θ
for 4 layer board (Note 6)
≤
350 mA
Human Body Model
Machine Model
JA
+85°C). Unless otherwise noted, specifications apply to
) in the application, as given by the following equation:T
JA
) (MicroSMD)
J-MAX
), the maximum power dissipation of the device in
A
J
Min
-2.5
590
2.7
1.0
1.6
) Range
) Range (Note
J
= 25°C. Limits in boldface type
J
= 150°C (typ.) and disengages at
(Notes 1, 2)
0.0015
0.025
0.01
0.01
Typ
350
150
750
0.5
16
2
−30°C to +125°C
−30°C to +85°C
0mA to 350 mA
+2.5
Max
450
250
855
5.5
0.4
2.6
2.7V to 5.5V
35
1
1
A-MAX
85°C/W
= T
200V
2 KV
%/mA
Units
MHz
%/V
J-MAX
mΩ
mΩ
mA
µA
µA
µA
%
V
V
V
V