MAS9278 MAS, MAS9278 Datasheet - Page 2

• Manufacturer Part Number: MAS9278
• Description: IC for 10.00 - 30.00 MHz VCXO
• Manufacturer: MAS

PIN DESCRIPTION
Note: Because the substrate of the die is internally connected to GND, the die has to be connected to GND or
left floating. Make sure that GND is the first pad to be bonded. Pick-and-place and all component assembly are
recommended to be performed in ESD protected area.
Note: Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The
coordinates may vary depending on sawing width and location, however, distances between pads are accurate.
ABSOLUTE MAXIMUM RATINGS
Note: Not valid for programming pin PV.
RECOMMENDED OPERATION CONDITIONS
Parameter
Supply Voltage
Input Voltage
Power Dissipation
Storage Temperature
Pin Description
Power Supply Voltage
Serial Bus Data Input
Serial Bus Clock Input
Programming Input
Voltage Control Input
Crystal Oscillator Output
Power Supply Ground
Crystal/Varactor Oscillator Input
Buffer Output
Parameter
Supply Voltage
Supply Current
Operating Temperature
Crystal Load Capacitance
Symbol
V
I
T
C
CC
DD
C
L
Symbol
V
Symbol
OUT
VDD
DD
CLK
VSS
DA
VC
PV
P
X1
X2
T
V
MAX
ST
- V
IN
Vcc = 2.8 Volt
SS
Conditions
V
x-coordinate
SS
Min
-0.3
-55
-0.3
1042
1012
177
435
201
374
830
817
665
V
DD
Max
150
Min
6.0
2.7
-30
20
+ 0.3
0.85
Typ
2.8
7.0
y-coordinate
Unit
mW
o
V
V
C
1015
1015
1015
1008
1015
172
158
158
158
Max
+85
5.5
13 July 2006
DA9278.004
Note
Unit
1)
mA
pF
o
V
C
2 (5)