MAS6180 Micro Analog systems, MAS6180 Datasheet - Page 2

• Manufacturer Part Number: MAS6180
• Description: AM Receiver IC
• Manufacturer: Micro Analog systems

MAS6180 PAD LAYOUT
Note: Because the substrate of the die is internally connected to VSS, the die has to be connected to VSS or left
floating. Please make sure that VSS is the first pad to be bonded. Pick-and-place and all component assembly
are recommended to be performed in ESD protected area.
Note: Coordinates are pad center points where origin has been located in bottom-left corner of the silicon die.
Pad Identification
Power Supply Voltage
Positive Quartz Filter Output for Crystal
Negative Quartz Filter Output for Crystal
Quartz Filter Input for Crystal and External
Compensation Capacitor
AGC Capacitor
Receiver Output
Demodulator Capacitor
AGC On Control
Power Down
Positive Receiver Input
Negative Receiver Input
Power Supply Ground
Notes:
1) External crystal compensation capacitor pin QOM is connected only in MAS6180A5 version. It is left
2) OUT = VSS when carrier amplitude at maximum; OUT = VDD when carrier amplitude is reduced (modulated)
3) AON = VSS means AGC off (hold current gain level); AON = VDD means AGC on (working)
4) PDN = VSS means receiver on; PDN = VDD means receiver off
5) Receiver inputs RFIP and RFIM have both 600 kΩ biasing resistors towards VDD
unconnected in MAS6180A1 and A2 versions which have internal compensation capacitor.
-
-
-
Fast start-up is triggered when the receiver is after power down (PDN=VDD) controlled to power up
(PDN=VSS) i.e. at the falling edge of PDN signal.
the output is a current source/sink with |I
at power down the output is pulled to VSS (pull down switch)
Internal pull-up with current < 1 µA which is switched off at power down
DIE size = 1.07 mm x 1.37 mm; PAD size = 80 µm x 80 µm
MAS6180Ax,
x = 1, 2, 5
QOM
QOP
AGC
VDD
OUT
QI
OUT
Name
QOM
RFIM
RFIP
QOP
AGC
AON
VDD
OUT
DEC
PDN
VSS
QI
| > 5 µA
1070 µ µ µ µ m
X-coordinate
152 µm
152 µm
152 µm
152 µm
152 µm
152 µm
915 µm
915 µm
915 µm
915 µm
915 µm
915 µm
VSS pad
bonded
first!
PDN
DEC
VSS
RFIM
RFIP
AON
Y-coordinate
1137 µm
1002 µm
1010 µm
1158 µm
815 µm
629 µm
443 µm
257 µm
265 µm
451 µm
636 µm
824 µm
27 December, 2006
DA6180.001
Note
1
2
3
4
5
5
2 (9)