MAS1175 Micro Analog systems, MAS1175 Datasheet - Page 2

• Manufacturer Part Number: MAS1175
• Description: IC FOR 10.00 - 20.00 MHz VCTCXO
• Manufacturer: Micro Analog systems

PIN DESCRIPTION
Note: Because the substrate of the die is internally connected to VDD, the die has to be connected to VDD or
left floating. Make sure that VDD is the first pad to be bonded. Pick-and-place and all component assembly are
recommended to be performed in ESD protected area.
Note: Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The
coordinates may vary depending on sawing width and location, however, distances between pads are accurate.
ABSOLUTE MAXIMUM RATINGS
Note: Not valid for programming pin PV
RECOMMENDED OPERATION CONDITIONS
Parameter
Supply Voltage
Input Voltage
Power Dissipation
Storage Temperature
Pin Description
Power Supply Voltage
Programming Input
Serial Bus Clock Input
Serial Bus Data Input
Temperature Output
Test Multiplexer Output
Voltage Control Input
Crystal Oscillator Output
Crystal/Varactor Oscillator Input
Power Supply Ground
Buffer Output
Parameter
Supply Voltage
Supply Current
Operable Temperature
Storage Temperature
Crystal Pulling Sensitivity
Load Capacitance
Symbol
V
I
T
C
T
CC
S
DD
C
S
L
Symbol
V
Symbol
OUT
VDD
DD
CLK
VSS
TE1
TE2
DA
VC
PV
P
X1
X2
T
V
MAX
Relative humidity =
ST
- V
IN
Vcc = 2.8 Volt
SS
Conditions
15%…70%
V
x-coordinate
SS
Min
-0.3
-55
-0.3
1001
1246
1454
1355
1828
2031
263
503
745
190
398
V
DD
Max
150
Min
6.0
2.7
-30
20
-5
+ 0.3
Typ
2.8
30
10
y-coordinate
Unit
mW
o
V
V
C
1330
1326
1321
1321
1325
1325
231
231
231
242
231
Max
+85
+40
5.5
1.8
13 July, 2006
DA1175.008
ppm/pF
Note
Unit
1)
mA
pF
o
o
V
C
C
2 (9)