BZD27-C10 Philips Semiconductors, BZD27-C10 Datasheet

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BZD27-C10

Manufacturer Part Number
BZD27-C10
Description
Voltage regulator diodes
Manufacturer
Philips Semiconductors
Datasheet

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Part Number:
BZD27-C10
Manufacturer:
NXP
Quantity:
39 000
Product specification
Supersedes data of October 1991
ok, halfpage
DATA SHEET
BZD27 series
Voltage regulator diodes
M3D121
DISCRETE SEMICONDUCTORS
1996 Jun 10

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BZD27-C10 Summary of contents

Page 1

... DISCRETE SEMICONDUCTORS DATA SHEET ok, halfpage M3D121 BZD27 series Voltage regulator diodes Product specification Supersedes data of October 1991 1996 Jun 10 ...

Page 2

... ZSM power dissipation BZD27-C3V6 to -C6V8 BZD27-C7V5 to -C510 P non-repetitive peak reverse RSM power dissipation BZD27-C7V5 to -C510 T storage temperature stg BZD27-C3V6 to -C6V8 BZD27-C7V5 to -C510 T junction temperature j BZD27-C3V6 to -C6V8 BZD27-C7V5 to -C510 1996 Jun 10 DESCRIPTION Cavity free cylindrical glass SOD87 (1) package through Implotec technology. This package is ...

Page 3

... Product specification BZD27 series MIN. MAX. 1.2 TEST REVERSE CURRENT CURRENT at REVERSE VOLTAGE (mA) Z MAX. MAX. 0.04 100 100 0.04 100 50 0.02 100 25 0.00 100 10 0.02 100 5 0.04 100 10 0.06 100 5 0.07 100 10 0.07 100 50 0 ...

Page 4

... C200 208 220 233 C220 228 240 256 C240 251 270 289 C270 Note 1. To complete the type number the suffix is added to the basic type number, e.g. BZD27-C51. 1996 Jun 10 DIFFERENTIAL TEMPERATURE RESISTANCE COEFFICIENT (%/ dif Z Z MAX. TYP. ...

Page 5

... BZD27-C24 25.1 BZD27-C27 28 BZD27-C30 31 BZD27-C33 34 BZD27-C36 37 BZD27-C39 40 BZD27-C43 44 BZD27-C47 48 BZD27-C51 52 BZD27-C56 58 BZD27-C62 64 BZD27-C68 70 BZD27-C75 77 BZD27-C82 85 BZD27-C91 94 BZD27-C100 104 BZD27-C110 114 BZD27-C120 124 BZD27-C130 138 BZD27-C150 153 BZD27-C160 1996 Jun 10 TEST TEMPERATURE CURREN COEFFICIENT T S (%/ test test (mA) MIN. MAX. 0.00 0.07 100 0.03 0.08 100 ...

Page 6

... Note 1. Non-repetitive peak reverse current in accordance with “IEC 60-1, Section 8” (10/1000 s pulse); see Fig.8. THERMAL CHARACTERISTICS SYMBOL R thermal resistance from junction to tie-point th j-tp BZD27-C3V6 to -C6V8 BZD27-C7V5 to -C510 R thermal resistance from junction to ambient th j-a BZD27-C3V6 to -C6V8 BZD27-C7V5 to -C510 Note 1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer 40 m, see Fig.7. ...

Page 7

... Philips Semiconductors Voltage regulator diodes GRAPHICAL DATA 3 handbook, halfpage P tot ( 100 Types BZD27-C3V6 to -C6V8 Solid line: tie-point temperature. Dotted line: ambient temperature; device mounted as shown in Fig.7. Fig.2 Maximum total power dissipation as a function of temperature handbook, halfpage P ZSM ( ...

Page 8

... In accordance with “IEC 60-1, Section 8” 1000 s. 2 Fig.8 Non-repetitive peak reverse current pulse definition. 1996 Jun 10 MGD520 (V) Dimensions in mm. Fig.7 Printed-circuit board for surface mounting. t MGD521 8 Product specification BZD27 series 50 4.5 50 2.5 1.25 MSB213 ...

Page 9

... Philips customers using or selling these products for use in such applications their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1996 Jun 10 3.5 0.2 0.3 2. 0.05 1.9 MBA505 0.1 Fig.9 SOD87. 9 Product specification BZD27 series ...

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