SMP50-XXX STMicroelectronics, SMP50-XXX Datasheet - Page 5

• Manufacturer Part Number: SMP50-XXX
• Description: TELECOM EQUIPMENT PROTECTION: TRISIL
• Manufacturer: STMicroelectronics

Fig. 3: Relative variation of holding current versus
junction temperature.
Fig. 5: Relative variation of leakage current versus
junction temperature (typical values).
Fig. 7: Relative variation of junction capacitance
versus reverse voltage applied (typical values).
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
2000
1000
2.5
2.0
1.5
1.0
0.5
0.0
100
-40
10
1
C [VR] / C [VR=50V]
1
IH[Tj] / IH[Tj=25°C]
25
IRM[Tj] / IRM[Tj=25°C]
VR=VRM
-20
2
0
50
5
20
10
Tj(°C)
VR(V)
Tj(°C)
40
75
20
60
50
80
100
100
100
VRMS=1V
F=1MHz
Tj=25°C
120
125
300
Fig. 4: Relative variation of breakover voltage ver-
sus junction temperature.
1.08
1.06
1.04
1.02
1.00
0.98
0.96
0.94
Fig. 6: Relative variation of thermal impedance
versus pulse duration.
200
100
10
1E-3
1
-40
Zth(j-a)(°C/W)
VBO[Tj] / VBO[Tj=25°C]
-20
1E-2
0
1E-1
20
tp (s)
Tj(°C)
1E+0
40
60
Zth(j-a)
1E+1
80
SMP50-xxx
1E+2 5E+2
100
120
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