SMP50 ST Microelectronics, SMP50 Datasheet - Page 5

• Manufacturer Part Number: SMP50
• Description: TRISIL FOR TELECOM EQUIPMENT PROTECTION
• Manufacturer: ST Microelectronics

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4
Figure 8: Variation of thermal impedance
junction to ambient versus pulse duration
(Printed
recommended pad layout)
Figure 10: Test circuit 1 for Dynamic I
1E+2
1E+0
1E+1
1E-1
1E-3
Z
th(j-a)
(°C/W)
circuit
1E-2
100 V / µs, di /dt < 10 A / µs, Ipp = 50 A
U
U
1 kV / µs, di /dt < 10 A / µs, Ipp = 10 A
KeyTek 'System 2' generator with PN246I module
KeyTek 'System 2' generator with PN246I module
1E-1
SMTPA / TPA
board
10 µF
60 µF
t (s)
26 µH
p
1E+0
SMP50
FR4,
2 Ω
1E+1
12 Ω
SCu=35µm,
BO
1E+2
250 Ω
and V
5E+2
45 Ω
BO
parameters
47 Ω
Figure 9: Relative variation of junction
capacitance versus reverse voltage applied
(typical values)
2.5
2.0
1.5
1.0
0.5
0.0
66 Ω
C[V ] / C[V =50V]
1
R
470 Ω
46 µH
2
R
5
0.36 nF
83 Ω
10
SMP50 / SMTPA / TPA
V (V)
R
20
46 µH
50
100
V
F=1MHz
T =25°C
RMS
j
=1V
5/10
300