LMX9820 National Semiconductor, LMX9820 Datasheet - Page 36
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LMX9820
Manufacturer Part Number
LMX9820
Description
Bluetooth Serial Port Module
Manufacturer
National Semiconductor
Datasheet
1.LMX9820.pdf
(40 pages)
www.national.com
15.0 Soldering
The LMX9820 bumps are designed to melt as part of the
Surface Mount Assembly (SMA) process. The LMX9820 is
assembled with a high temperature solder alloy to ensure
there are no re-reflow conditions imposed upon the module
when reflowed to a PCB with these typical low temperature
60/40 (S = 183°C, L = 188°C), 62/36/2 (E = 179°C), or
63/37 (E = 183°C) solder alloys.
Where:
• S: Solidus
• L: Liquidus
1.
Parameter
PCB Land Pad Diameter
PCB Solder Mask Opening
PCB Finish (HASL details)
Stencil Aperture
Stencil Thickness
Solder Paste Used
Flux Cleaning Process
Reflow Profiles
– Denotes the points in a phase diagram representing
– Denotes the points in a phase diagram representing
Typically defined by customer.
the temperature at which the solder composition be-
gins to melt during heating, or complete freezing dur-
ing cooling.
Table 39. Soldering Details
36
Low temperature 60/40 (S = 183°C, L = 188°C), 62/36/2 (E
• E: Eutectic
The low temperature solder alloy will reflow with the solder
bump and provide the maximum allowable solder joint reli-
ability.
Reflow at a peak of 215 --> 220°C (approximately 30 sec-
onds at peak) [not to exceed 225°C; measured in close
proximity of the modules] to avoid any potential re-reflow
conditions.
Table 39 and Figure 26 on page 37 provide the soldering
details required to properly solder the LMX9820 to stan-
dard PCBs. The illustration serves only as a guide and
National is not liable if a selected profile does not work.
– Denotes solid to liquid without a plastic phase.
= 179°C), or 63/37 (E = 183°C) solder alloys
63/37 (difference in thickness < 28 micron)
the temperature at which the solder has molten com-
ponents. The temperature that melting starts at.
See Figure 26 on page 37
No Clean Flux System
Value
24 mil
30 mil
28 mil
5 mil
1
1