GF1 Vishay Intertechnology, GF1 Datasheet
GF1
Manufacturer Part Number
GF1
Description
Manufacturer
Vishay Intertechnology
Datasheet
1.GF1.pdf
(2 pages)
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Mechanical Data
Case: JEDEC DO-214BA, molded plastic over glass body
Terminals: Solder plated, solderable per MIL-STD-750,
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight: 0.0048 oz, 0.120 g
Maximum Ratings & Thermal Characteristics
Parameter
Device marking code
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current at T
Peak forward surge current 8.3ms single half sine-wave
superimposed on rated load (JEDEC Method)
Typical thermal resistance
Operating junction and storage temperature range
Electrical Characteristics
Parameter
Maximum instantaneous forward voltage at 1.0A
Maximum DC reverse current
at rated DC blocking voltage
Typical reverse recovery time at
I
Typical junction capacitance at 4.0V, 1MHz
Note: (1) Thermal resistance from junction to ambient and from junction to lead, P.C.B. mounted on 0.2 x 0.2” (5.0 x 5.0mm) copper pad areas
Document Number 88617
08-Jul-02
0.030 (0.76)
F
0.060 (1.52)
0.118 (3.00)
0.100 (2.54)
= 0.5A, I
0.040 (1.02)
0.066 (1.68)
R
Method 2026
= 1.0A, I
DO-214BA (GF1)
0.167 (4.24)
0.187 (4.75)
0.226 (5.74)
0.196 (4.98)
0.006 (0.152) TYP.
rr
0.0065 (0.17)
= 0.25 A
0.015 (0.38)
Surface Mount Glass Passivated Rectifier
(1)
No. 3,930,306 and lead forming by Patent No. 5,151,846
Patent No. 3,996,602, brazen-lead assembly by Patent
Glass-plastic encapsulation technique is covered by
(T
0.094 (2.39)
0.114 (2.90)
J
T
T
= 25°C unless otherwise noted)
Dimensions in inches and (millimeters)
L
A
A
= 125°C
= 25°C
= 125°C
0.098 (2.49)
0.108 (2.74)
Symbol GF1A GF1B GF1D GF1G GF1J GF1K GF1M Unit
Symbol GF1A GF1B GF1D GF1G GF1J GF1K GF1M Unit
T
V
V
I
R
R
I
J
V
F(AV)
FSM
,T
RRM
RMS
V
C
I
t
DC
R
rr
F
STG
JA
J
JL
Features
• Plastic package has Underwriters Laboratories
• Ideal for surface mount automotive applications
• High temperature metallurgically bonded construction
• Cavity-free glass passivated junction
• Capable of meeting environmental standards of
• Built-in strain relief • Easy pick and place
• High temperature soldering guaranteed:
• Complete device submersible temperature of 265°C for
GA
50
35
50
Flammability Classification 94V-0
MIL-S-19500
450°C/5 seconds at terminals.
10 seconds in solder bath
Ratings at 25°C ambient temperature unless otherwise specified.
100
100
GB
70
200
140
200
GD
–65 to +175
0.052 MIN.
(1.32 MIN.)
(1.68 MIN.)
0.066 MIN.
Vishay Semiconductors
1.10
formerly General Semiconductor
GG
400
280
400
1.0
5.0
3.0
30
80
26
50
15
Mounting Pad Layout
GF1A thru GF1M
Reverse Voltage 50 to 1000V
600
420
600
GJ
(5.58) REF
0.220
Forward Current 1.0A
800
560
800
GK
1.20
(2.38 MAX.)
0.094 MAX.
www.vishay.com
1000
1000
700
GM
°C/W
pF
°C
V
V
V
A
A
V
A
s
1
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