NCP5603 ON Semiconductor, NCP5603 Datasheet - Page 12

• Manufacturer Part Number: NCP5603
• Description: High Efficiency Charge Pump Converter
• Manufacturer: ON Semiconductor

10X
2X
2X
REFERENCE
0.10 C
0.05 C
10X
10X
0.10 C
0.08 C
0.15 C
K
L
PIN 1
0.15 C
NOTE 3
A B
10X
Ç Ç Ç Ç
Ç Ç Ç Ç
Ç Ç Ç Ç
DETAIL B
b
10
BOTTOM VIEW
1
SIDE VIEW
TOP VIEW
e
D2
D
5
6
(A3)
A1
DETAIL A
A
B
E
E2
A
PACKAGE DIMENSIONS
C
SEATING
PLANE
http://onsemi.com
L1
MOLD CMPD
CASE 485C−01
MN SUFFIX
NCP5603
ISSUE A
Bottom View
DFN10
A1
(Optional)
DETAIL A
12
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.5651
(Optional)
Side View
DETAIL B
EDGE OF PACKAGE
É É
É É
10X
2.1746
0.3008
EXPOSED Cu
10X
SOLDERING FOOTPRINT*
A3
2.6016
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
4. COPLANARITY APPLIES TO THE EXPOSED
5. TERMINAL b MAY HAVE MOLD COMPOUND
6. DETAILS A AND B SHOW OPTIONAL VIEWS
ASME Y14.5M, 1994.
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
PAD AS WELL AS THE TERMINALS.
MATERIAL ALONG SIDE EDGE. MOLD
FLASHING MAY NOT EXCEED 30 MICRONS
ONTO BOTTOM SURFACE OF TERMINAL b.
FOR END OF TERMINAL LEAD AT EDGE OF
PACKAGE.
DIM
A1
A3
D2
E2
L1
A
b
D
E
K
L
e
MILLIMETERS
0.80
0.00
0.18
2.45
1.75
0.35
0.00
DIMENSIONS: MILLIMETERS
MIN
3.00 BSC
3.00 BSC
0.50 BSC
0.20 REF
0.19 TYP
MAX
1.00
0.05
0.30
2.55
1.85
0.45
0.03
0.5000 PITCH
1.8508
3.3048