MCP606 Microchip Technology, MCP606 Datasheet - Page 21

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MCP606

Manufacturer Part Number
MCP606
Description
2.5V to 5.5V Micropower CMOS Op Amps
Manufacturer
Microchip Technology
Datasheet

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8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
2000 Microchip Technology Inc.
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
n
eB
E1
E
Dimension Limits
§
2
1
Units
A2
E1
B1
eB
A1
A
E
D
B
n
p
L
c
c
D
MIN
.140
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
A
A1
.100
.155
.130
.313
.250
.373
.130
.012
.058
.018
.370
MCP606/607/608/609
10
10
8
B1
B
MAX
.170
.145
.325
.260
.385
.135
.015
.070
.022
.430
15
15
MIN
0.20
0.36
7.87
3.56
2.92
0.38
7.62
6.10
9.14
3.18
1.14
5
5
MILLIMETERS
NOM
2.54
3.94
3.30
7.94
6.35
9.46
3.30
0.29
1.46
0.46
9.40
10
10
8
p
A2
DS11177B-page 21
MAX
10.92
L
4.32
3.68
8.26
6.60
9.78
3.43
0.38
1.78
0.56
15
15

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