TDA8034T Philips Semiconductors, TDA8034T Datasheet
TDA8034T
Available stocks
Related parts for TDA8034T
TDA8034T Summary of contents
Page 1
... Rev. 01 — 5 February 2010 1. General description The TDA8034T/TDA8034AT is a cost-effective analog interface for asynchronous and synchronous smart cards operating Using few external components, the TDA8034T/TDA8034AT provides all supply, protection and control functions between a smart card and the microcontroller. 2. Features I ...
Page 2
... Ordering information Table 2. Ordering information Type number Package Name TDA8034T SO16 TDA8034AT TDA8034T_TDA8034AT_1 Product data sheet TDA8034T; TDA8034AT = 10 MHz; GND = xtal amb Conditions pin V DDP pin V DD pin V DD(INTF) Shutdown mode Shutdown mode ...
Page 3
... RSTIN 5 CMDVCCN 15 LEVEL OFFN SHIFTER 6 CLKDIV1 CIRCUITRY 16 I/OUC OSCILLATOR 3 V DD(INTF) XTAL1 100 nF Fig 1. Block diagram TDA8034T_TDA8034AT_1 Product data sheet TDA8034T; TDA8034AT GND 9 INTERNAL OSCILLATOR CLKUP ALARMN EN1 PVCC SEQUENCER EN4 EN3 EN2 CLK CLOCK THERMAL PROTECTION TDA8034T CRYSTAL TDA8034AT 1 2 XTAL2 Rev. 01 — ...
Page 4
... I = input output, I/O = input/output ground and P = power supply. [2] If pin PRESN is HIGH, the card is considered to be present. During card insertion, debouncing can occur on these signals. To counter this, the TDA8034T/TDA8034AT has a built-in debouncing timer (typically 4.5 ms). [3] Uses an internal 11 k pull-up resistor connected to pin V ...
Page 5
... This device has a Low Drop-Off (LDO) voltage regulator connected to pin V used instead of a DC-to-DC converter. It ensures a minimum V power supply voltage on pin mA. 8.2 Voltage supervisor Fig 3. TDA8034T_TDA8034AT_1 Product data sheet TDA8034T; TDA8034AT . 5.5 V falls below the falling threshold voltage (V DDP ) is only used during the activation sequences. osc(int) does not fall below 4 ...
Page 6
... Power-On Reset (POR) and supply drop-out detection during a card session. The supervisor threshold voltages for V than has reached a level higher than V The output of the supervisor is sent to a digital controller in order to reset the TDA8034T/TDA8034AT. This defined reset pulse of approximately 8 ms, i. fosc(int)low voltage power on; see V falls below V DDP Remark: f parameter ...
Page 7
... The active pull-up feature ensures fast LOW-to-HIGH transitions making the TDA8034T/TDA8034AT capable of delivering more than 1 mA output voltage of 0. load of 80 pF. At the end of the active pull-up pulse, the output voltage is CC dependent on the internal pull-up resistor value and load current ...
Page 8
... NXP Semiconductors 8.5 Shutdown mode After a power-on reset, if pin CMDVCCN is HIGH, the circuit enters the Shutdown mode, ensuring only the minimum number of circuits are active while the TDA8034T/TDA8034AT waits for the microcontroller to start a session. • all card contacts are inactive. The impedance between the contacts and GND is approximately 200 . • ...
Page 9
... OSCINT Fig 6. 8.7 Deactivation sequence When a session ends, the microcontroller sets pin CMDVCCN HIGH. The TDA8034T/TDA8034AT then executes an automatic deactivation sequence by counting the sequencer back to the inactive state (see 1. Pin RST is pulled LOW (t11). 2. The clock is stopped, pin CLK is LOW (t12). 3. Pin I/O is pulled LOW (t13). ...
Page 10
... HIGH if the card is in the reader. Any voltage drop the voltage supervisor. This generates an internal power-on reset pulse but does not act upon the pin OFFN signal. The card is not powered-up and short-circuits or overheating are not detected. TDA8034T_TDA8034AT_1 Product data sheet TDA8034T; TDA8034AT high frequency t10 t11 t12 t13 t deact OSCINT = internal oscillator ...
Page 11
... On card insertion or removal, bouncing can occur in the PRESN signal. This depends on the type of card presence switch in the connector (normally open or normally closed) and the mechanical characteristics of the switch. To correct for this, a debouncing feature is integrated in to the TDA8034T/TDA8034AT. This feature operates at a typical duration of 4 deb debouncing feature ...
Page 12
... If pin CMDVCCN is HIGH for more than 15 ms (t0 > 15 ms) but less than 30 ms, pin CMDVCCN must be set LOW for t1 (200 s < t1 < 700 s), and then HIGH for t2 (200 s < t2 < 15 ms) before going LOW. TDA8034T_TDA8034AT_1 Product data sheet TDA8034T; TDA8034AT t deb (1) ) that the card requires is determined automatically by monitoring CC set ...
Page 13
... V electrostatic discharge voltage ESD 10. Thermal characteristics Table 6. Thermal characteristics Symbol Package name Parameter R SO16 thermal resistance from junction to ambient th(j-a) TDA8034T_TDA8034AT_1 Product data sheet TDA8034T; TDA8034AT CMDVCCN > Figure 12 Table 5 Conditions pin V DDP pin V DD pin V ...
Page 14
... I output current o V supply voltage CC V peak-to-peak ripple ripple(p-p) voltage I supply current CC SR slew rate TDA8034T_TDA8034AT_1 Product data sheet TDA8034T; TDA8034AT = 10 MHz; GND = xtal amb Conditions Min pin V 4.85 DDP pin V 2.7 DD 1.6 DD(INTF) Shutdown mode - Shutdown mode f stopped ...
Page 15
... TDA8034T_TDA8034AT_1 Product data sheet TDA8034T; TDA8034AT …continued = 10 MHz; GND = xtal amb Conditions Min pins XTAL1 and XTAL2 - (depending on the crystal or resonator specification) card clock reference; crystal 2 oscillator ...
Page 16
... I output current o t delay time d V LOW-level output OL voltage V HIGH-level output OH voltage t rise time r TDA8034T_TDA8034AT_1 Product data sheet TDA8034T; TDA8034AT …continued = 10 MHz; GND = xtal amb Conditions Min connected 0. [ load ...
Page 17
... I HIGH-level input IH current f frequency on pin CMDVCCN CMDVCCN t pulse width w [6][7] Card detection input V LOW-level input voltage IL TDA8034T_TDA8034AT_1 Product data sheet TDA8034T; TDA8034AT …continued = 10 MHz; GND = xtal amb Conditions Min C = 100 Shutdown mode no load Shutdown mode; pin CLK ...
Page 18
... Table 9. Timing characteristics Symbol Parameter t activation time act t deactivation time deact t delay time d t debounce time deb TDA8034T_TDA8034AT_1 Product data sheet TDA8034T; TDA8034AT …continued = 10 MHz; GND = xtal amb Conditions Min 0.7V pin PRESN - < DD(INTF < V < DD(INTF) I ...
Page 19
... NXP Semiconductors Fig 13. Definition of output and input transition times 12. Application information V DD(INTF) Fig 14. Application diagram TDA8034T_TDA8034AT_1 Product data sheet TDA8034T; TDA8034AT MICROCONTROLLER TDA8034T TDA8034AT XTAL1 DD(INTF) XTAL2 DD(INTF RSTIN 100 ...
Page 20
... Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINE VERSION IEC SOT109-1 076E07 Fig 15. Package outline SOT109-1 (SO16) TDA8034T_TDA8034AT_1 Product data sheet TDA8034T; TDA8034AT 2.5 scale (1) ( ...
Page 21
... Solder bath specifications, including temperature and impurities TDA8034T_TDA8034AT_1 Product data sheet TDA8034T; TDA8034AT Rev. 01 — 5 February 2010 www.DataSheet4U.com Smart card interface © NXP B.V. 2010. All rights reserved ...
Page 22
... Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see TDA8034T_TDA8034AT_1 Product data sheet TDA8034T; TDA8034AT and 11 SnPb eutectic process (from J-STD-020C) Package reflow temperature ( C) 3 Volume (mm ) < ...
Page 23
... EMV ESD ESR FCDM HBM LDO MM NMOS POR TDA8034T_TDA8034AT_1 Product data sheet TDA8034T; TDA8034AT maximum peak temperature = MSL limit, damage level minimum peak temperature = minimum soldering temperature MSL: Moisture Sensitivity Level Abbreviations Description Europay MasterCard VISA ElectroStatic Discharge Equivalent Series Resistor ...
Page 24
... NXP Semiconductors 16. Revision history Table 13. Revision history Document ID Release date TDA8034T_TDA8034AT_1 20100205 TDA8034T_TDA8034AT_1 Product data sheet TDA8034T; TDA8034AT Data sheet status Change notice Product data sheet - Rev. 01 — 5 February 2010 www.DataSheet4U.com Smart card interface Supersedes - © NXP B.V. 2010. All rights reserved. ...
Page 25
... TDA8034T_TDA8034AT_1 Product data sheet TDA8034T; TDA8034AT [3] Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. ...
Page 26
... For sales office addresses, please send an email to: TDA8034T_TDA8034AT_1 Product data sheet TDA8034T; TDA8034AT damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. ...
Page 27
... Protection characteristics . . . . . . . . . . . . . . . . .18 Table 9. Timing characteristics . . . . . . . . . . . . . . . . . . .18 Table 10. SnPb eutectic process (from J-STD-020C .22 Table 11. Lead-free process (from J-STD-020C .22 Table 12. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . .23 Table 13. Revision history . . . . . . . . . . . . . . . . . . . . . . . .24 TDA8034T_TDA8034AT_1 Product data sheet TDA8034T; TDA8034AT Rev. 01 — 5 February 2010 www.DataSheet4U.com Smart card interface © NXP B.V. 2010. All rights reserved ...
Page 28
... Fig 13. Definition of output and input transition times . . .19 Fig 14. Application diagram . . . . . . . . . . . . . . . . . . . . . . .19 Fig 15. Package outline SOT109-1 (SO16 .20 Fig 16. Temperature profiles for large and small components . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23 TDA8034T_TDA8034AT_1 Product data sheet TDA8034T; TDA8034AT . . . . . . . . . . . . . . .12 CC Rev. 01 — 5 February 2010 www.DataSheet4U.com Smart card interface © NXP B.V. 2010. All rights reserved. ...
Page 29
... Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Document identifier: TDA8034T_TDA8034AT_1 Smart card interface All rights reserved. Date of release: 5 February 2010 ...