MCP1827-1002E/ET Microchip Technology, MCP1827-1002E/ET Datasheet - Page 23
MCP1827-1002E/ET
Manufacturer Part Number
MCP1827-1002E/ET
Description
1.5A LDO, 133K ANALOG 0.6UM POLY GATE, TRIPLE METAL W/ESD FUSE PROCESS, -40C to +125C, 5-DDPAK, TUBE
Manufacturer
Microchip Technology
Datasheet
1.MCP1827-1002EET.pdf
(32 pages)
©
3-Lead Plastic (EB) [DDPAK]
Notes:
1. § Significant Characteristic.
2. Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
2007 Microchip Technology Inc.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A1
A
H
Number of Pins
Pitch
Overall Height
Standoff §
Overall Width
Exposed Pad Width
Molded Package Length
Overall Length
Exposed Pad Length
Lead Thickness
Pad Thickness
Lower Lead Width
Upper Lead Width
Foot Length
Pad Length
Foot Angle
b1
b
1
TOP VIEW
E
e
N
c
L1
D
Dimension Limits
φ
D1
Units
A1
E1
D1
C2
b1
L1
N
A
E
D
H
e
c
b
L
φ
L
MCP1827/MCP1827S
BOTTOM VIEW
MIN
.160
.000
.380
.245
.330
.549
.270
.014
.045
.020
.045
.068
0°
–
E1
.100 BSC
INCHES
NOM
3
–
–
–
–
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-011B
CHAMFER
OPTIONAL
C2
MAX
.420
.190
.010
.380
.625
.029
.065
.039
.070
.110
.067
8°
–
–
DS22001C-page 23