TDA2824 ST Microelectronics, TDA2824 Datasheet - Page 8

• Manufacturer Part Number: TDA2824
• Description: DUAL POWER AMPLIFIER
• Manufacturer: ST Microelectronics

TDA2824
8/10
MOUNTING INSTRUCTION
The R
dering the GND pins to a suitable copperarea of the
printed circuit board (Figure 13) or to an external
heatsink (Figure 14).
The diagram of Figure 15 shows the maximum dis-
sipable power P
the side” ” oftwo equalsquare copper areas having
a thickness of 35
Figure 13 : Example of P.C. Board Copper Area
Figure 15 : Maximum Dissipable Power and
th j-amb
which is used as Heatsink.
Junction to Ambient Thermal
Resistance vs. Side ” ”.
of the TDA2824 can be reduced by sol-
tot
and the R
(1.4 mils).
th j-amb
as a function of
During soldering the pins temperature must not ex-
ceed 260 C and the soldering time must not be
longer than 12 seconds.
The external heatsink or printed circuit copper area
must be connected to electrical ground.
Figure 14 : External Heatsink Mounting Example.
Figure 16 : Maximum Allowable Power Dissipa-
tion vs. Ambient Temperature.