MCP1700 Microchip Technology, MCP1700 Datasheet - Page 18

• Manufacturer Part Number: MCP1700
• Description: Low Quiescent Current LDO
• Manufacturer: Microchip Technology

MCP1700
DS21826B-page 18
3-Lead Plastic Transistor Outline (TO or ZB) [TO-92]
Notes:
1. Dimensions A and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" per side.
2. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1
e
E
Number of Pins
Pitch
Bottom to Package Flat
Overall Width
Overall Length
Molded Package Radius
Tip to Seating Plane
Lead Thickness
Lead Width
N
R
b
A
L
c
1 2
3
Dimension Limits
Units
N
D
E
A
R
e
L
b
c
MIN
.125
.175
.170
.080
.500
.014
.014
.050 BSC
INCHES
Microchip Technology Drawing C04-101B
3
MAX
.165
.205
.210
.105
.021
.022
© 2007 Microchip Technology Inc.
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D