MCP1256 Microchip Technology, MCP1256 Datasheet - Page 17

• Manufacturer Part Number: MCP1256
• Description: Regulated 3.3V, Low-Ripple Charge Pump with Low-Operating Current SLEEP Mode or BYPASS Mode
• Manufacturer: Microchip Technology

10-Lead Plastic Micro Small Outline Package (UN) (MSOP)
© 2006 Microchip Technology Inc.
B
c
REF: Reference Dime n sion, usually witho ut tolerance, for information purposes only.
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254 mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
JEDEC Equivalent: MO-187 BA
Drawing No. C04-021
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bott om
p
See ASME Y14.5M
See ASME Y14.5M
n
Dimension Limits
E1
E
Units
A2
E1
A1
p
E
D
L
F
B
n
A
c
MIN
(F)
.030
.000
.016
.003
.006
L
0°
5°
5°
2
1
.020 BSC
.193 BSC
.118 BSC
.118 BSC
.037 REF
INCHES
NOM
D
.033
.024
.009
10
–
–
–
–
MAX
A1
A
.043
.037
.006
.031
.009
.012
15°
15°
8°
MCP1256/7/8/9
MIN
0.75
0.00
0.40
0.08
0.15
0°
5°
5°
MILLIMETERS*
–
0.50 BSC
4.90 BSC
3.00 BSC
3.00 BSC
Revised 09-16-05
0.95 REF
NOM
0.85
0.60
0.23
10
–
–
–
–
–
DS21989A-page 17
MAX
1.10
0.95
0.15
0.80
0.23
0.30
15°
15°
A2
8°