CML0306 Cyntec Co., Ltd., CML0306 Datasheet - Page 8

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CML0306

Manufacturer Part Number
CML0306
Description
0201 Series Thin Film Chip Inductor Lead / Halogen Free
Manufacturer
Cyntec Co., Ltd.
Datasheet

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CYNTEC CO., LTD.
乾坤科技股份有限公司
乾坤科技股份有限公司
乾坤科技股份有限公司
乾坤科技股份有限公司
5-2 Mechanical
Substrate
bending test
(Bond strength
of the face
plating)
Body Strength
Item
Apply pressure in the direction of the arrow at a rate
of about 1mm/s. until bent width reaches 3 mm and
hold for 30 seconds.
Refer to IEC 60115-1, Sub-clause 4.33
A load of 10N (1.02kgf) using a R0.5 pressure rod
shall be applied to the center in the direction of
arrow and held for 10 ± 1 seconds.
Supports
( 5)
Loading
Testing board A
Press Jig
Solder
R230
45
Conditions
1/2L
R0.5
L
20
50
Within ±2mm
Specimen
45
Pressure rod
Unit : mm
Specimen
Unit : mm
DOCUMENT : CYNP-8Z-031
REVISION
PAGE
No mechanical damage
shall be observed.
DC Resistance
Characteristics shall be
within specification.
No mechanical damage
shall be observed.
Electric haracteris-tics
shall be within
specification.
Specifications
: 8 OF 15
: A5

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