CMPA2060025D Cree, Inc., CMPA2060025D Datasheet - Page 3

• Manufacturer Part Number: CMPA2060025D
• Description: Cree, Cmpa2060025d 25w, 2.0-6.0ghz, Gan Hemt Mmic Cree Wireless Gan-on-sic Mmic
• Manufacturer: Cree, Inc.

Die Dimensions (units in inches)
Die Assembly Notes:
Copyright © 2010-2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
and the Cree logo are registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their
respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association.
Pad Number
3
•
•
•
•
•
•
•
10
1
2
3
4
5
6
7
8
9
Notes:
1
2
ground pads are 0.005” x 0.005.”
Recommended solder is AuSn (80/20) solder. Refer to Cree’s website for the Eutectic Die Bond Procedure
application note at
Vacuum collet is the preferred method of pick-up.
The backside of the die is the Source (ground) contact.
Die back side gold plating is 5 microns thick minimum.
Thermosonic ball or wedge bonding are the preferred connection methods.
Gold wire must be used for connections.
Use the die label (XX-YY) for correct orientation.
Attach bypass capacitor to pads 2-9 per application circuit.
The RF Input and Output pad have a ground-signal-ground with a nominal pitch of 9 mil (240 um). The RF
CMPA2060025D Rev 0.2, Preliminary
Function
RF-Out
VG1_A
VG1_B
VD1_A
VD1_B
VG2_A
VG2_B
VD2_A
VD2_B
RF-IN
Overall die size 0.142 x 0.144 (+0/-0.005) inches, die thickness 0.004 inches.
RF-Input pad. Matched to 50 ohm.
Gate control for stage 1. V
Gate control for stage 1. V
Drain supply for stage 1. V
Drain supply for stage 1. V
Gate control for stage 2A. V
Gate control for stage 2A. V
Drain supply for stage 2A. V
Drain supply for stage 2B. V
RF-Output pad. Requires external matching circuit for optimal performance freq. > 4.0 GHz
All Gate and Drain pads must be wire bonded for electrical connection.
http://www.cree.com/products/wireless_appnotes.asp
G
G
D
D
G
G
~ 2.0 - 3.5 V.
~ 2.0 - 3.5 V.
D
D
= 28 V.
= 28 V.
~ 2.0 - 3.5 V.
~ 2.0 - 3.5 V.
= 28 V.
= 28 V.
Description
0.008” x 0.008”
0.006” x 0.005”
0.006” x 0.005”
0.009” x 0.006”
0.009” x 0.006”
0.007” x 0.007”
0.007” x 0.007”
0.008” x 0.008”
Pad Size (in)
USA Tel: [phone]
www.cree.com/wireless
Fax: [phone]
–
–
Durham, NC 27703
4600 Silicon Drive
Cree, Inc.
Note
1,2
1,2
3
1
1
1
1
1
1
3