BAS70-08S ETC-unknow, BAS70-08S Datasheet
BAS70-08S
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BAS70-08S Summary of contents
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... FRM I Surge non repetitive forward current FSM P Power Dissipation T Storage temperature range stg Tj Maximum junction temperature TL Maximum temperature for soldering December 2001 - Ed: 2A BAS70-07S / BAS70-08S RF DETECTION DIODE BAS70-08S SCHEMATIC DIAGRAM Parameter sinusoidal 55°C SOT323- Value ...
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... BAS70-07S / BAS70-08S THERMAL RESISTANCE Symbol R Junction to ambient on printed circuit board FR4 th (j-a) with recommended pad layout STATIC ELECTRICAL CHARACTERISTICS (Tj = 25°C otherwise specified) Symbol Parameter V Forward voltage drop F I Reverse leakage current R V Breakdown voltage BR ELECTRICAL CHARACTERISTICS Symbol Parameter C Junction capacitance R Differential forward ...
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... Fig. 6: Thermal resistance junction to ambient versus copper surface under each lead (printed circuit board, epoxy FR4). Rth(j-a) 600 550 500 450 400 350 300 1.E+01 1.E+02 0 BAS70-07S / BAS70-08S IR(µ 150° 85° 25°C VR( VR( S(mm² ...
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... BAS70-07S / BAS70-08S PACKAGE MECHANICAL DATA SOT323- FOOTPRINT DIMENSIONS (millimeters) 0.3mm 1mm 1mm 0.35mm MARKING Type Marking BAS70-07S D32 BAS70-08S D33 Epoxy meets UL94, V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics ...