MMDF2N05ZR2 Motorola, MMDF2N05ZR2 Datasheet
MMDF2N05ZR2
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MMDF2N05ZR2 Summary of contents
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... Bergquist Company. REV 1 Motorola TMOS Power MOSFET Transistor Device Data Motorola, Inc. 1997 D G Rating Tape Width Quantity 2500 units Order this document by MMDF2N05ZR2/D MMDF2N05ZR2 Motorola Preferred Device DUAL TMOS POWER MOSFET 2.0 AMPERES 50 VOLTS R DS(on) = 0.300 OHM CASE 751–05, Style 11 SO–8 S ...
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... MMDF2N05ZR2 ELECTRICAL CHARACTERISTICS ( unless otherwise noted) Characteristic OFF CHARACTERISTICS Drain–to–Source Breakdown Voltage ( Vdc 0.25 mAdc) Temperature Coefficient (Positive) Zero Gate Voltage Drain Current ( Vdc Vdc Vdc Vdc Gate–Body Leakage Current ( ...
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... Figure 4. On–Resistance versus Drain Current 100 0.1 0. 100 125 150 DRAIN–TO–SOURCE VOLTAGE (VOLTS) Figure 6. Drain–to–Source Leakage Current MMDF2N05ZR2 100 –55 C 3.5 4 4.5 5 5 2.5 3 3 DRAIN CURRENT (AMPS) ...
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... MMDF2N05ZR2 Switching behavior is most easily modeled and predicted by recognizing that the power MOSFET is charge controlled. The lengths of various switching intervals ( t) are deter- mined by how fast the FET input capacitance can be charged by current from the generator. The published capacitance data is difficult to use for calculat- ing rise and fall because drain– ...
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... In addition, power dissipation incurred from switching the diode will be less due to the shorter recovery time and lower switching losses 0.55 0.6 0.65 0.7 0. SOURCE–TO–DRAIN VOLTAGE (VOLTS) MMDF2N05ZR2 t d(off d(on GATE RESISTANCE (OHMS) Figure 9. Resistive Switching Time Variation versus Gate Resistance 0.8 0.85 ...
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... MMDF2N05ZR2 The Forward Biased Safe Operating Area curves define the maximum simultaneous drain–to–source voltage and drain current that a transistor can handle safely when it is for- ward biased. Curves are based upon maximum peak junc- tion temperature and a case temperature ( Peak ...
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... Figure 14. Diode Reverse Recovery Waveform Motorola TMOS Power MOSFET Transistor Device Data Dual SO–8 Thermal RC Network Chip 0.0106 0.0431 0.1643 0.0253 F 0.1406 F 0.5064 F 1.0E–02 1.0E–01 1.0E+00 t, TIME (s) Figure 13. Thermal Response di/ TIME 0. MMDF2N05ZR2 0.3507 0.4302 2.9468 F 177.14 F Ambient 1.0E+01 1.0E+02 1.0E+03 7 ...
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... MMDF2N05ZR2 INFORMATION FOR USING THE SO–8 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to ensure proper solder connection interface 0.024 The power dissipation of the SO– ...
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... C 160 C 150 C SOLDER IS LIQUID FOR SECONDS 100 C 140 C (DEPENDING ON MASS OF ASSEMBLY) DESIRED CURVE FOR LOW MASS ASSEMBLIES Figure 15. Typical Solder Heating Profile MMDF2N05ZR2 STEP 6 STEP 7 VENT COOLING 205 TO 219 C PEAK AT SOLDER JOINT T MAX 9 ...
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... PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS OF THE B DIMENSION AT MAXIMUM MATERIAL CONDITION. MILLIMETERS DIM MIN MAX A 1.35 1.75 A1 0.10 0.25 B 0.35 0.49 C 0.18 0.25 D 4.80 5.00 E 3.80 4.00 e 1.27 BSC H 5.80 6.20 h 0.25 0.50 L 0.40 1. STYLE 11: PIN 1. SOURCE 1 2. GATE 1 3. SOURCE 2 4. GATE 2 5. DRAIN 2 6. DRAIN 2 7. DRAIN 1 8. DRAIN 1 Mfax is a trademark of Motorola, Inc. MMDF2N05ZR2/D ...