SL1ICS3101 Philips Semiconductors, SL1ICS3101 Datasheet
SL1ICS3101
Related parts for SL1ICS3101
SL1ICS3101 Summary of contents
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SL1 ICS31 01 I•CODE1 Label IC (97pF) Chip Specification Product Specification Revision 1.2 Public Philips Semiconductors INTEGRATED CIRCUITS July 2000 ...
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Product Specification 1 Contents 1 CONTENTS 2 DEFINITIONS 2.1 Life Support Applications .................................................................................................... 4 2.2 Abbreviations ........................................................................................................................ 4 3 SCOPE 4 ORDERING INFORMATION 5 FUNCTIONAL DESCRIPTION 5.1 Basic Features ....................................................................................................................... 6 5.2 Block Diagram of the IC....................................................................................................... 6 5.3 Memory ...
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Product Specification 11 HANDLING RECOMMENDATIONS 11.1 Sawing .................................................................................................................................. 14 11.2 Die Attach............................................................................................................................. 14 11.3 Wire Bonding....................................................................................................................... 14 12 COIL SPECIFICATION 13 ELECTRICAL SPECIFICATIONS 14 HINTS FOR LABEL IC ENCAPSULATION 14.1 Protection against Visible Light......................................................................................... 16 14.2 Protection against UV Light............................................................................................... ...
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Product Specification 2 Definitions Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains ...
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Product Specification 3 Scope This specification describes the electrical, physical and dimensional properties of unsawn and sawn wafers on FFC of I•CODE1 Label ICs (C base for delivery of tested I•CODE1 Label ICs. General recommendations are given for storage, handling ...
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Product Specification 5 Functional Description 5.1 Basic Features The I•CODE1 Label dedicated chip for intelligent label applications like logistics and retail (including EAS) as well as baggage and parcel identification in airline business and mail services. The ...
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Product Specification 5.3 Memory Organisation The 512 bit EEPROM memory is divided into 16 blocks. A block is the smallest access unit. Each block consists of 4 bytes (1 block = 32 bits). Bit 0 in each byte represents the ...
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Product Specification 5.3.3 Special Functions (EAS/QUIET) The Special Functions block holds the two EAS bits (Electronic Article Surveillance mode active à the label answers at an EAS command) as well as the two QUIET bits (QUIET mode enabled à the ...
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Product Specification 6 Mechanical Die Specifications Designation: Bond pad location: Bond pad size: LA, LB Test pad size: TEST, VSS Bond pad metallisation material: Metallisation thickness: Die dimensions (incl. 80 µm scribe line) Die dimensions (excl. scribe line) Tolerances for ...
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Product Specification 7 Mechanical Wafer Specifications For further information as described in the following chapters please refer to the following Philips documents: Dicing Guidelines for Thin Wafers (< 200 µm) General Specification for 6” Wafer In case of doubt or ...
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Product Specification 8 Documentation 8.1 Delivery Documentation Each wafer container and each larger shipment container is individually marked with the identification information as follows: Diffusion Batch number (wafer lot number) Part designation (type) with revision number Ordering code (see chapter ...
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Product Specification 9 Quality Assurance 9.1 Electrical Acceptance Test The electrical acceptance test is performed in line (‘sampling on the fly’) according to the test specifications. Sampling plan: 9.2 Visual Inspection 9.2.1 After Wafer Final Test Performed according document SNW-FQ-627. ...
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... Storage Recommendations Unsawn/sawn wafers should be kept in their original packing whilst in storage. Recommended storage conditions: Temperature: Climate atmosphere: Duration of storage: Deviating requirements have to be arranged between customer and Philips Semiconductors. 10.2 Possible Forms of Delivery 10.2.1 Packing of Unsawn Wafers Delivery form: 10.2.2 Packing of Sawn Wafers Delivery form: ...
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Product Specification 11 Handling Recommendations Please refer to Philips ‘General Specification for 6” Wafer’ for the following items: 11.1 Sawing 11.2 Die Attach 11.3 Wire Bonding 12 Coil Specification The I•CODE1 Label IC has to be connected at pads LA, ...
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Product Specification 13 Electrical Specifications ABSOLUTE MAXIMUM RATINGS SYMBOL PARAMETER T Storage Temperature Range stg T Junction Temperature j V ESD Voltage Immunity ESD I Maximum Input Peak Current max LA-LB NOTES: 1. Stresses above those listed under Absolute Maximum ...
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Product Specification 14 Hints for Label IC Encapsulation 14.1 Protection against Visible Light As a result of the ultra low power design of the I•CODE1 Label IC some analogue circuits on the chip are light sensitive. This means that common ...
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Product Specification 15 Inlet/Label Characterisation and Test 15.1 Characterisation of the Inlet/Label The parameters recommended to be characterised for the inlet/label are: Parameter Threshold field strength for UNSELECTED READ command (standard mode) Threshold resonance frequency Threshold field strength for WRITE ...
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Product Specification 16 Appendix A: Die Plan Measuring unit: µm The two test pads (TEST and VSS) are electrically neutral at sawn wafers! July 2000 SL1 ICS31 01 Page Rev. 1.2 Public ...
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Product Specification 17 Appendix B: Cluster Plan Measuring unit: mm July 2000 SL1 ICS31 01 Page Rev. 1.2 Public ...
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Product Specification 18 Appendix C: Cluster Map The three black lines show the position of the PCM structures on the 6 inch wafer! July 2000 SL1 ICS31 01 Page Rev. 1.2 Public ...
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Product Specification 19 Appendix D: Wafer Map The following screenshot shows an example of a wafer map: Map file of this example: ELECTROGLAS APPLICATIONS - WAFER TEST DATA FILE COPYRIGHT ASCEND LOT 09397 DEVICE VCOL1HE2 PRODUCT VCOL\4020 WAFER 05 READER ...
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... Mexico: Philips Components, El Paso, Texas, Tel. +1 915 772-4020 Middle East : see Italy Published by: Philips Semiconductors Gratkorn GmbH, Mikron-Weg 1, A-8101 Gratkorn, Austria, Fax: +43 3124 299 270 For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax: + 24825 Internet: http://www.semiconductors.philips.com © ...