10EL11 ON Semiconductor, 10EL11 Datasheet - Page 5

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10EL11

Manufacturer Part Number
10EL11
Description
Search -----> MC10EL11
Manufacturer
ON Semiconductor
Datasheet
www.DataSheet4U.com
Table 8. AC CHARACTERISTICS
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
14. 10 Series: V
15. Within-device skew defined as identical transitions on similar paths through a device.
16. Duty cycle skew is the difference between a t
17. V
f
t
t
t
t
V
t
t
Symbol
max
PLH
PHL
SKEW
JITTER
r
f
PP
100 Series: V
PP
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
(min) is minimum input swing for which AC parameters guaranteed. The device has a DC gain of ≈ 40.
Maximum Toggle Frequency
Propagation Delay to Output
Within-Device Skew (Note 15)
Duty Cycle Skew (Note 16)
Random Clock Jitter (RMS)
Input Swing (Note 17)
Output Rise/Fall Times Q
(20% − 80%)
EE
EE
can vary +0.25 V / −0.5 V.
can vary +0.8 V / −0.5 V.
Characteristic
(See Application Note AND8020/D − Termination of ECL Logic Devices.)
Driver
Device
Figure 2. Typical Termination for Output Driver and Device Evaluation
V
CC
Q
Q
= 5.0 V; V
PLH
MC10EL11, MC100EL11
and t
EE
Min
135
150
100
= 0.0 V or V
PHL
Z
Z
http://onsemi.com
o
o
= 50 W
= 50 W
propagation delay through a device.
−40°C
Typ
260
225
5
5
50 W
V
5
CC
TT
= 0.0 V; V
= V
1000
Max
385
350
V
CC
TT
− 3.0 V
50 W
Min
190
150
100
EE
= −5.0 V (Note 14)
25°C
Typ
265
225
1.5
0.6
5
5
D
D
1000
Max
340
350
20
20
Receiver
Device
Min
215
150
100
85°C
29*0
Typ
225
5
5
1000
Max
365
350
20
20
Unit
GHz
mV
ps
ps
ps
ps

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