STD100NH03L ST Microelectronics, STD100NH03L Datasheet

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STD100NH03L

Manufacturer Part Number
STD100NH03L
Description
N-CHANNEL POWER MOSFET
Manufacturer
ST Microelectronics
Datasheet

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Part Number:
STD100NH03L
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ST
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Part Number:
STD100NH03LT4
Manufacturer:
ST
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Part Number:
STD100NH03LT4
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Quantity:
200
DESCRIPTION
The STD100NH03L utilizes the latest advanced design
rules of ST’s proprietary STripFET™ technology. This is
suitable fot the most demanding DC-DC converter
application where high efficiency is to be achieved.
APPLICATIONS
Ordering Information
ABSOLUTE MAXIMUM RATINGS
September 2003
STD100NH03L
STD100NH03LT4
TYPICAL R
R
CONDUCTION LOSSES REDUCED
SWITCHING LOSSES REDUCED
LOW THRESHOLD DEVICE
SURFACE-MOUNTING DPAK (TO-252)
POWER PACKAGE IN TAPE & REEL
(SUFFIX “T4")
SPECIFICALLY DESIGNED AND OPTIMISED
FOR HIGH EFFICIENCY DC/DC CONVERTES
Symbol
E
DS(ON)
V
I
DM (3)
V
I
I
V
P
AS (4)
T
D (2)
D (2)
DGR
T
GS
stg
DS
TYPE
tot
j
SALES TYPE
* Qg INDUSTRY’s BENCHMARK
Drain-source Voltage (V
Drain-gate Voltage (R
Gate- source Voltage
Drain Current (continuous) at T
Drain Current (continuous) at T
Drain Current (pulsed)
Total Dissipation at T
Derating Factor
Single Pulse Avalanche Energy
Storage Temperature
Max. Operating Junction Temperature
DS
(on) = 0.005
V
30 V
DSS
Parameter
< 0.0055
R
DS(on)
@ 10 V
C
GS
= 25°C
GS
= 20 k )
D100NH03L
MARKING
= 0)
N-CHANNEL 30V - 0.005
C
C
60 A(2)
= 25°C
= 100°C
I
D
STripFET™ III POWER MOSFET
INTERNAL SCHEMATIC DIAGRAM
PACKAGE
TO-252
-55 to 175
Value
± 20
0.66
240
100
700
30
30
60
60
STD100NH03L
(Suffix “T4”)
TO-252
DPAK
1
- 60A DPAK
TAPE & REEL
PACKAGING
3
W/°C
Unit
mJ
°C
W
V
V
V
A
A
A
1/11

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STD100NH03L Summary of contents

Page 1

... LOW THRESHOLD DEVICE SURFACE-MOUNTING DPAK (TO-252) POWER PACKAGE IN TAPE & REEL (SUFFIX “T4") DESCRIPTION The STD100NH03L utilizes the latest advanced design rules of ST’s proprietary STripFET™ technology. This is suitable fot the most demanding DC-DC converter application where high efficiency achieved. APPLICATIONS ...

Page 2

... STD100NH03L THERMAL DATA Rthj-case Thermal Resistance Junction-case Rthj-amb Thermal Resistance Junction-ambient Rthj-pcb Thermal Resistance Junction-pcb T Maximum Lead Temperature For Soldering Purpose l (#) 2 When Mounted on 1 inch FR-4 board Cu. ELECTRICAL CHARACTERISTICS (T OFF Symbol Parameter Drain-source V (BR)DSS Breakdown Voltage Zero Gate Voltage ...

Page 3

... STD100NH03L ELECTRICAL CHARACTERISTICS (continued) SWITCHING ON Symbol Parameter Turn-on Delay Time t d(on) Rise Time Total Gate Charge Source g Q Gate Charge gs Gate-Drain Charge Q gd oss (6) Q Output Charge gls (7) Q Third-quadrant Gate Charge SWITCHING OFF Symbol Parameter t Turn-off Delay Time d(off) Fall Time ...

Page 4

... STD100NH03L Output Characteristics Transconductance Gate Charge vs Gate-source Voltage 4/11 Transfer Characteristics Static Drain-source On Resistance Capacitance Variations ...

Page 5

... STD100NH03L Normalized Gate Threshold Voltage vs Temperature Source-drain Diode Forward Characteristics . Normalized on Resistance vs Temperature Normalized Breakdown Voltage vs Temperature . 5/11 ...

Page 6

... STD100NH03L Fig. 1: Unclamped Inductive Load Test Circuit Fig. 1: Unclamped Inductive Load Test Circuit Fig. 3: Switching Times Test Circuits For Resistive Load Fig. 5: Test Circuit For Inductive Load Switching And Diode Recovery Times 6/11 Fig. 2: Unclamped Inductive Waveform Fig. 4: Gate Charge test Circuit ...

Page 7

... STD100NH03L TO-252 (DPAK) MECHANICAL DATA DIM. MIN. A 2.2 A1 0.9 A2 0.03 B 0.64 B2 5.2 C 0. 6.4 G 4 TYP. MAX. 2.4 1.1 0.23 0.9 5.4 0.6 0.6 6.2 6.6 4.6 10.1 0 DETAIL "A" inch MIN. TYP. MAX. 0.086 0.094 0.035 0.043 0.001 0.009 0.025 0.035 0.204 0.212 0.017 0.023 0.019 0.023 0.236 ...

Page 8

... STD100NH03L 8/11 ...

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