ISL9208 Intersil Corporation, ISL9208 Datasheet - Page 9

no-image

ISL9208

Manufacturer Part Number
ISL9208
Description
Multi-Cell Li-ion Battery Pack OCP/Analog Front End
Manufacturer
Intersil Corporation
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ISL9208IRZ
Manufacturer:
Intersil
Quantity:
500
Part Number:
ISL9208IRZ
Manufacturer:
INTERSIL
Quantity:
20 000
Part Number:
ISL9208IRZ-T
Manufacturer:
OSRAM
Quantity:
2 506
Operating Specifications
NOTE:
SERIAL INTERFACE CHARACTERISTICS (OVER RECOMMENDED OPERATING CONDITIONS UNLESS OTHERWISE SPECIFIED)
SCL Clock Frequency
Pulse Width Suppression Time at SDA
and SCL Inputs
SCL Falling Edge to SDA Output Data
Valid
Time the Bus Must Be Free Before Start
of New Transmission
Clock Low Time
Clock High Time
Start Condition Setup Time
Start Condition Hold Time
Input Data Setup Time
Input Data Hold Time
Stop Condition Setup Time
Stop Condition Hold Time
Data Output Hold Time
SDA and SCL Rise Time
SDA and SCL Fall Time
Capacitive Loading Of SDA Or SCL
SDA and SCL Bus Pull-up Resistor-
Off Chip
Input Leakage Current (SCL, SDA)
Input Buffer Low Voltage (SCL, SDA)
Input Buffer High Voltage (SCL, SDA)
Output Buffer Low Voltage (SDA)
SDA and SCL Input Buffer Hysteresis
3. Power up of the device requires all V
4. The device provides an internal hold time of at least 300ns for the SDA signal to bridge the unidentified region of the falling edge of SCL.
5. Typical +125°C ±10%, based on design and characterization data.
6. Typical 5Ω ±2Ω, based on design and characterization data.
7. Maximum output capacitance = 15pF.
PARAMETER
Over the recommended operating conditions unless otherwise specified (Continued)
9
CELL1
SYMBOL
I
t
t
t
2
t
t
t
HD:DAT
SU:STO
HD:STO
SU:STA
HD:STA
SU:DAT
t
R
CHYST Sleep bit = 0
t
t
f
HIGH
LOW
V
SCL
t
BUF
t
V
V
Cb
t
OUT
AA
DH
t
I
t
IN
LI
OL
R
F
IH
IL
, V
CELL2
Any pulse narrower than the max spec is
suppressed.
From SCL falling crossing V
SDA exits the V
SDA crossing V
condition to SDA crossing V
the following START condition.
Measured at the V
Measured at the V
SCL rising edge to SDA falling edge. Both
crossing the V
From SDA falling edge crossing V
SCL falling edge crossing V
From SDA exiting the V
window to SCL rising edge crossing V
From SCL rising edge crossing V
SDA entering the V
window.
From SCL rising edge crossing V
SDA rising edge crossing V
From SDA rising edge to SCL falling edge.
Both crossing V
From SCL falling edge crossing V
until SDA enters the V
window. (Note 4)
From V
From V
Total on-chip and off-chip
Maximum is determined by t
For C
For C
Voltage relative to V
Voltage relative to V
I
OL
, V
= 1mA
B
B
CELL3
IL
IH
= 400pF, max is about 2~2.5kΩ
= 40pF, max is about 15kΩ to 20kΩ
(max) to V
(min) to V
, and VCC to be above the limits specified.
TEST CONDITION
IH
IL
IH
IH
ISL9208
(min) level.
(max) to V
(min) during a STOP
(min).
IL
IH
IL
IL
IH
SS
SS
(max) crossing.
(min) crossing.
(max).
(max) to V
(min).
IL
of the device.
of the device.
IL
(max) to V
(max) to V
IL
IH
IH
IH
IH
R
(max).
(min).
(min) window.
(min), until
(min) during
and t
IH
IH
IH
(min)
IL
IL
IH
(min) to
(min) to
(max)
F
(max) to
IH
(min)
.
IL
(min)
(min).
0.05 * V
V
RGO
MIN
250
300
-0.3
4.7
4.7
4.0
4.7
4.0
4.0
4.0
-10
0
1
x 0.7
RGO
TYP
V
V
RGO
RGO
MAX
1000
100
300
400
3.5
0.4
50
10
February 16, 2007
+ 0.1V
x 0.3
FN6446.0
UNIT
kHz
µA
ns
µs
µs
µs
µs
µs
µs
ns
µs
µs
µs
ns
pF
ns
ns
V
V
V
V

Related parts for ISL9208