ISL73128RH Intersil Corporation, ISL73128RH Datasheet - Page 3

• Manufacturer Part Number: ISL73128RH
• Description: (ISL73xxxRH) Ultra High Frequency NPN-PNP Transistor Array
• Manufacturer: Intersil Corporation

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Die Characteristics
DIE DIMENSIONS:
INTERFACE MATERIALS:
Glassivation:
Top Metallization:
Substrate:
Backside Finish:
Metallization Mask Layout
52.8 mils x 52.0 mils x 14 mils ±1 mil
1340μm x 1320µm x 355.6µm ±25.4µm
Type: Nitride
Thickness: 4k
Type: Metal 1: AlCu (2%)/TiW
Thickness: Metal 1: 8k
Type: Metal 2: AlCu (2%)
Thickness: Metal 2: 16k
UHF-1X Bonded Wafer, DI
Silicon
Å
±0.5k
Å
Å
Å
±0.5k
±0.8k
3
Å
Å
ISL73096RH, ISL73127RH, ISL73128RH
FIGURE 1. ISL73096RH, ISL73127RH
(3) Q2E
(4) Q2B
(6) Q3C
(5) NC
ASSEMBLY RELATED INFORMATION:
Substrate Potential:
ADDITIONAL INFORMATION:
Worst Case Current Density:
Transistor Count:
Floating
3.04 x 10
5
(7) Q3E
(2) Q2C
5
A/cm
2
(8) Q3B (9) Q4B (10) Q4E
(1) Q1C
(16) Q1E
(15) Q1B
March 23, 2009
(14) Q5B
(13) Q5E
(12) Q5C
(11) Q4C
FN6475.2