ISL6700 Intersil Corporation, ISL6700 Datasheet - Page 4

• Manufacturer Part Number: ISL6700
• Description: 80V/1.25A Peak/ Medium Frequency/ Low Cost/ Half-Bridge Driver
• Manufacturer: Intersil Corporation

Absolute Maximum Ratings
Supply Voltage, V
LI and HI Voltages (Note 1) . . . . . . . . . . . . . . . . -0.3V to V
Voltage on HS (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . -1V to 80V
Voltage on HB (Note 1) . . . . . . . . . . . . . . . . V
Voltage on LO (Note 1) . . . . . . . . . . . . . . . . . V
Voltage on HO (Note 1) . . . . . . . . . . . . . . . . V
Phase Slew Rate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20V/ns
Maximum Recommended Operating Conditions
Supply Voltage, V
Voltage on HS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0V to 75V
Voltage on HS. . . . . . . . . . . . . . . . .(Repetitive Transient) -1V to 80V
Voltage on HB . . . . . . . . . . . . . . . . . . . . . . . . . . V
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the recommended operating conditions of this specification is not implied.
NOTES:
Electrical Specifications
SUPPLY CURRENTS & UNDER VOLTAGE PROTECTION
V
V
V
HB Off Quiescent Current
HB On Quiescent Current
HB Operating Current
HB Operating Current
HS Leakage Current
V
V
Undervoltage Hysteresis
HB Undervoltage Threshold
INPUT PINS: LI and HI
Low Level Input Voltage
High Level Input Voltage
Input Voltage Hysteresis
Low Level Input Current
High Level Input Current
1. All Voltages Referenced to Pin 4, V
2. θ
3. θ
DD
DD
DD
DD
DD
“case temp” is measured at the center of the exposed metal pad on the package underside. See Tech Brief TB379.
JA
JA
Quiescent Current
Operating Current
Operating Current
Rising Undervoltage Threshold
Falling Undervoltage Threshold
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. θ
is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
PARAMETERS
DD
DD
(Note 1) . . . . . . . . . . . . . . . . . . . -0.3V to 16V
. . . . . . . . . . . . . . . . . . . . . . . . . 9V to 15.0VDC
4
V
DD
SS
= V
Unless Otherwise Specified.
SYMBOL
V
V
HB
UVHYS
VHBUV
DDUV+
I
I
I
I
I
DDUV-
I
I
HS
HS
DDO
DDO
HBH
HBO
HBO
HS
I
HBL
HLK
V
V
I
DD
I
IH
= 12V, V
IL
SS
IH
IL
-0.3V to V
+7.5V to V
-0.3V to V
-0.3 to V
LI = 0 or V
f = 50kHz
f = 500kHz
HI = 0
HI = VDD
f = 50kHz, C
f = 500kHz, C
V
V
Referenced to HS
Full Operating Conditions
Full Operating Conditions
V
VIN = 5V, Full Operating Conditions
SS
HS
HB
IN
DD
DD
HB
HS
HS
= V
= 0V, Full Operating Conditions
= 80V
= 96V
+0.3V
+0.3V
+0.3V
+V
+V
HS
DD
DD
TEST CONDITIONS
= 0V, No Load on LO or HO, Unless Otherwise Specified
DD
ISL6700
L
L
= 1000pF
= 1000pF
Thermal Information
Thermal Resistance (Typical)
Max Power Dissipation at 25
Max Power Dissipation at 25
Maximum Storage Temperature Range. . . . . . . . . . . .-65
Maximum Junction Temperature Range . . . . . . . . -40
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . +300
For Recommended soldering conditions see Tech Brief TB389.
SOIC (Note 2) . . . . . . . . . . . . . . . . . . .
QFN (Note 3) . . . . . . . . . . . . . . . . . . . .
(SOIC - Lead Tips Only)
0.17
MIN
-70
6.8
6.5
5.0
0.8
30
-
-
-
-
-
-
-
-
-
-
T
J
o
o
C in Free Air (SOIC, Note 2) . . . 1.316W
C in Free Air (QFN, Note 3) . . . . 2.976W
= 25
TYP
1.25
1.45
0.45
170
100
115
1.9
2.0
2.5
2.4
7.6
7.1
5.3
1.6
1.7
-60
-
o
C
MAX
8.25
0.75
240
130
2.2
2.2
3.0
1.5
1.8
2.8
7.8
6.5
2.2
-30
1
-
-
θ
JA
6.25
0.15
MIN
T
6.5
4.0
0.8
-80
TO 125
30
-
-
-
-
-
-
-
-
-
-
J
(
95
49
o
= -40
C/W) θ
MAX
0.90
250
145
o
-30
2.4
2.5
4.0
1.8
2.0
3.0
8.5
8.1
7.5
2.2
o
o
1
o
C
-
-
C
C to +150
C to +150
JC
UNITS
N/A
(
JC,
o
7
mA
mA
mA
mV
mA
mA
mA
µA
µA
µA
µA
C/W)
V
V
V
V
V
V
the
o
o
o
C
C
C