ISL6613B Intersil Corporation, ISL6613B Datasheet - Page 3

• Manufacturer Part Number: ISL6613B
• Description: (ISL6612B / ISL6613B) Advanced Synchronous Rectified Buck MOSFET Drivers
• Manufacturer: Intersil Corporation

Ordering Information
NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
Contact the factory for availability.
Pinouts
Block Diagram
ISL6613BIB
ISL6613BIB-T
ISL6613BIBZ (Note)
ISL6613BIBZ-T (Note)
ISL6613BIR
ISL6613BIR-T
ISL6613BIRZ (Note)
ISL6613BIRZ-T (Note)
PART NUMBER
ISL6612BECB, ISL6613BECB (EPSOIC)
UGATE
ISL6612BCB, ISL6613BCB (SOIC)
BOOT
PWM
GND
PWM
VCC
1
2
3
4
TOP VIEW
6613BIB
6613BIB
6613BIBZ
6613BIBZ
13BI
13BI
3BIZ
3BIZ
GND
+5V
3
(Continued)
10K
PART MARKING
8K
8
7
6
5
CONTROL
PHASE
PVCC
VCC
LGATE
PRE-POR OVP
LOGIC
POR/
FEATURES
UVCC
ISL6612B, ISL6613B
ISL6612B AND ISL6613B
8 Ld SOIC Tape and Reel
8 Ld SOIC Tape and Reel (Pb-free)
10 Ld 3x3 DFN Tape and Reel
10 Ld 3x3 DFN Tape and Reel (Pb-free)
PAD
PROTECTION
-40°C to 85°C
-40°C to 85°C
-40°C to 85°C
-40°C to 85°C
RANGE (°C)
THROUGH
SHOOT-
TEMP.
FOR DFN AND EPSOIC-DEVICES, THE PAD ON THE BOTTOM SIDE OF
THE PACKAGE MUST BE SOLDERED TO THE CIRCUIT’S GROUND.
ISL6612BCR, ISL6613BCR (10L 3x3 DFN)
(LVCC)
8 Ld SOIC
8 Ld SOIC (Pb-free)
10 Ld 3x3 DFN
10 Ld 3x3 DFN (Pb-free)
UGATE
BOOT
PWM
GND
N/C
PACKAGE
1
2
3
4
5
TOP VIEW
BOOT
UGATE
PHASE
LGATE
GND
PVCC
GND
UVCC = VCC FOR ISL6612B
UVCC = PVCC FOR ISL6613B
10
9
8
7
6 LGATE
M8.15
M8.15
PHASE
PVCC
N/C
VCC
L10.3x3
L10.3x3
DWG. #
PKG.
July 27, 2006
FN9205.3